NCSG119 Nichia, NCSG119 Datasheet - Page 6

no-image

NCSG119

Manufacturer Part Number
NCSG119
Description
Manufacturer
Nichia
Datasheet

Specifications of NCSG119

Size Lxwxh (mm)
3.5x3.5x2.0
Lumi-nous Inten-sity Typ(cd)
41
Lumi-nous Flux Typ(lm))
128.0
Forward Voltage Vf(v) Typ
3.60
Forward Voltage Vf(v) Max
4.00
Directivity (degree)
120
If (ma)
350
Mounting Style
Through Hole

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
NCSG119T
Manufacturer:
NICHIA
Quantity:
23 000
SOLDERING
• Recommended Reflow Soldering Condition(Lead-free Solder)
• Recommended Soldering Pad Pattern
* This LED is designed to be reflow soldered on to a PCB. If dip soldered, Nichia cannot guarantee its reliability.
* Reflow soldering must not be performed more than twice. Hand soldering must not be performed more than once.
* Avoid rapid cooling. Ramp down the temperature gradually from the peak temperature.
* Nitrogen reflow soldering is recommended. Air flow soldering conditions can cause optical degradation,
* Since the silicone used in the encapsulating resin is soft, do not press on the encapsulant resin.
* Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable,
* When soldering, do not apply stress to the LED while the LED is hot.
caused by heat and/or atmosphere.
Pressure can cause nicks, chip-outs, encapsulant delamination and deformation, and bump breaks, decreasing reliability.
When using automatic pick and place machine, use a pick up nozzle which does not directly apply stress
to the encapsulation of the LEDs.
Recommended conditions:
a double-head soldering iron should be used.
It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.
1 to 5°C per sec
It is recommended to use a pick up nozzle designed for the LEDs. (See Figure below.)
* Avoid direct contact to the resin lens
Pre-heat
180 to 200°C
120sec Max
with the picking up nozzle.
Failure to comply might result in catastrophic failure
of the LEDs due to bump damage or breakage.
3.8
3
60sec Max
Above 220°C
4.1
0.6
(単位 Unit: mm)
260°C Max
10sec Max
(単位 Unit: mm)
• Recommended Hand Soldering Condition
Temperature
Soldering Time
350°C Max
3sec Max
5

Related parts for NCSG119