NSSM225 Nichia, NSSM225 Datasheet - Page 14

• Manufacturer Part Number: NSSM225
• Manufacturer: Nichia

Specifications of NSSM225

• Size Lxwxh (mm): 3.2x3.2x1.8
• Lumi-nous Inten-sity Typ(cd): 350
• Forward Voltage Vf(v) Typ: 3.20
• Forward Voltage Vf(v) Max: 3.50
• Directivity (degree): 115
• If (ma): 20
• Mounting Style: Through Hole

CAUTIONS
(1) Storage
(2) Directions for Use
(3) Handling Precautions
● This product is compliant to JEDEC MSL 3 or equivalent. See IPC/JEDEC STD-020 for the details of the moisture sensitivity levels.
● Interface delamination can occur due to vaporization and expansion of absorbed moisture
● After opening the moisture-proof aluminum bag, the products should be completed soldering process
● After the "Period After Opening" specified above, or if the desiccants (silica gel) are no longer blue, the products need to be baked.
● Customer is advised to keep the LEDs in an airtight container when not in use as exposure to a corrosive environment
● After assembly and during use, silver plating can be affected by the corrosive gases emitted by components and materials
● To avoid condensation, the products must not be stored in the areas where temperature and humidity fluctuate greatly.
● In designing a circuit, the current through each LED die must not exceed the Absolute Maximum Rating current
● When having the two or more dice within this product on at the same time, the total power dissipation for the LED package
● This product should be operated in forward bias. A driving circuit must be designed
● For stabilizing the LED characteristics, it is recommended to operate at 10% of the rated current or higher.
● Care must be taken to ensure that the reverse voltage will not exceed the Absolute Maximum Rating
● For outdoor use, necessary measures should be taken to prevent water, moisture and salt air damage.
● When handling the product, do not touch it directly with bare hands as it may contaminate the surface
● When handling the product with tweezers, make sure that excessive force is not applied to the resin portion of the product.
● If the product is dropped, it might be damaged.
● Do not stack assembled PCBs together. Failure to comply can cause the resin portion of the product to be cut, chipped,
Storage
Baking
in the LED packages caused by soldering heat, which may result in degradation in optical performance.
To minimize moisture absorption into the products during the transportation and storage, the products are packed
in a moisture-proof aluminum bag. Desiccants (silica gel) inside the packing turn from blue to red as it absorbs moisture.
within the range of the conditions above. If unused LEDs remain, they should be stored with desiccants (silica gel)
in hermetically sealed container. Nichia recommends using the original moisture-proof bag for storage.
Note that baking must only be done once.
might cause the plated metal parts of the product to tarnish, which might lead to difficulties in soldering and/or adverse effects
on optical characteristics. It is also recommended to return the LEDs to the original moisture proof bag
and seal the moisture proof bag again.
in close proximity of the LEDs within an end product, and the gases entering into the product from the external atmosphere.
The above should be taken into consideration when designing. After assembly and during use,
silver plating can be affected by the corrosive gases emitted by components and materials in close proximity of the LEDs
within an end product, and the gases entering into the product from the external atmosphere.
The above should be taken into consideration when designing. Resin materials, in particular, may contain substances
which affects on silver plating, such as halogen.
specified for each die.
It is recommended that each LED die is driven at a constant current.
must be within the absolute maximum value specified in this specification.
so that the product is not subjected to either forward or reverse voltage while it is off. In particular,
if a reverse voltage is continuously applied to the product, such operation can cause migration resulting in LED damage.
when using the LEDs with matrix drive.
and affect on optical characteristics. In the worst cases, excessive force to the product might result in catastrophic failure
due to package damage and/or wire breakage.
Failure to comply can cause the resin portion of the product to be cut, chipped, delaminated and/or deformed,
and wire to be broken, and thus resulting in catastrophic failure.
delaminated and/or deformed, and wire to be broken, and thus resulting in catastrophic failure.
Before Opening Aluminum Bag
After Opening Aluminum Bag
Conditions
≤30°C
≤30°C
65±5°C
Temperature
≤90%RH
≤70%RH
-
Humidity
Within 1 Year from Delivery Date
≤168hours
≥24hours
Time
13