NHSB046-N3 Nichia, NHSB046-N3 Datasheet - Page 7

• Manufacturer Part Number: NHSB046-N3
• Manufacturer: Nichia

Specifications of NHSB046-N3

• Size Lxwxh (mm): 2.2x1.4x1.3
• Lumi-nous Inten-sity Typ(cd): 85
• Forward Voltage Vf(v) Typ: 2.90
• Forward Voltage Vf(v) Max: 3.10
• Directivity (degree): 115
• If (ma): 5
• Mounting Style: Through Hole

SOLDERING
• Recommended Reflow Soldering Condition(Lead-free Solder)
● Recommended Soldering Pad Pattern
* The product is designed to be dip soldered and reflow soldered to a PCB.
* Reflow soldering must not be performed more than twice. Dip soldering and manual soldering must only be done once.
* Care should be taken to avoid cooling at a rapid rate and ensure the peak temperature ramps down slowly.
* Customer is advised to use nitrogen reflow soldering as air flow process can cause optical degradation
* Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable,
* When soldering, avoid applying any stress to the LED package while heated.
due to the heat and atmosphere of reflow soldering.
a double-head soldering iron should be used.
It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.
1 to 5°C per sec
Blank boxes: Solder resist opening , Shaded areas: Footprint
Pre-heat
180 to 200°C
120sec Max
4
0.8
60sec Max
Above 220°C
9.2
0.8
4
260°C Max
10sec Max
(単位 Unit: mm)
• Recommended Manual Soldering Condition
• Dip Soldering
Temperature
Soldering Time
Pre-heat
Pre-heat Time
Solder Bath
Temperature
Dipping Time
350°C Max
3sec Max
100°C Max
60sec Max
260°C Max
10sec Max
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