IRLML5203TR International Rectifier Corp., IRLML5203TR Datasheet

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IRLML5203TR

Manufacturer Part Number
IRLML5203TR
Description
Manufacturer
International Rectifier Corp.
Datasheet

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l
l
l
l
l
Description
Thermal Resistance
These P-channel MOSFETs from International Rectifier
utilize advanced processing techniques to achieve the
extremely low on-resistance per silicon area. This
benefit provides the designer with an extremely efficient
device for use in battery and load management
applications.
A thermally enhanced large pad leadframe has been
incorporated into the standard SOT-23 package to
produce a HEXFET Power MOSFET with the industry's
smallest footprint. This package, dubbed the Micro3
is ideal for applications where printed circuit board
space is at a premium. The low profile (<1.1mm) of
the Micro3 allows it to fit easily into extremely thin
application environments such as portable electronics
and PCMCIA cards. The thermal resistance and
power dissipation are the best available.
www.irf.com
V
I
I
I
P
P
V
T
R
D
D
DM
J,
DS
D
D
GS
θJA
@ T
@ T
Ultra Low On-Resistance
Surface Mount
Available in Tape & Reel
Low Gate Charge
@T
@T
T
P-Channel MOSFET
STG
A
A
A
A
= 70°C
= 25°C
= 25°C
= 70°C
Drain- Source Voltage
Continuous Drain Current, V
Continuous Drain Current, V
Pulsed Drain Current 
Power Dissipation
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Junction and Storage Temperature Range
Maximum Junction-to-Ambient
Parameter
Parameter
GS
GS
PROVISIONAL
ƒ
@ -10V
@ -10V
TM
,
G 1
S
V
-30V
2
DSS
R
HEXFET Power MOSFET
DS(on)
165@V
-55 to + 150
98@V
3
Max.
IRLML5203
Max.
D
100
1.25
0.80
-3.0
-2.4
± 20
-30
-24
10
GS
max (mW)
GS
= -10V
= -4.5V
Micro3
PD - 93967A
-3.0A
-2.6A
TM
mW/°C
I
Units
Units
°C/W
D
°C
V
A
V
04/30/03
1

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IRLML5203TR Summary of contents

Page 1

Ultra Low On-Resistance l l P-Channel MOSFET Surface Mount l Available in Tape & Reel l l Low Gate Charge Description These P-channel MOSFETs from International Rectifier utilize advanced processing techniques to achieve the extremely low on-resistance per silicon area. ...

Page 2

Electrical Characteristics @ T Parameter V Drain-to-Source Breakdown Voltage (BR)DSS ∆V Breakdown Voltage Temp. Coefficient /∆T (BR)DSS J R Static Drain-to-Source On-Resistance DS(on) V Gate Threshold Voltage GS(th) g Forward Transconductance fs I Drain-to-Source Leakage Current DSS Gate-to-Source Forward Leakage ...

Page 3

VGS TOP -15V -10V -7.0V -5.5V -4.5V -4.0V 10 -3.5V BOTTOM -2.7V 1 -2.70V 0.1 20µs PULSE WIDTH 0.01 0 Drain-to-Source Voltage (V) DS Fig 1. Typical Output Characteristics 100 10 ...

Page 4

1MHz iss rss oss ds gd 600 C iss 400 200 C oss C rss 0 ...

Page 5

T , Case Temperature ( C) C Fig 9. Maximum Drain Current Vs. Case Temperature 1000 100 D = 0.50 0.20 0.10 10 0.05 0.02 0.01 1 SINGLE PULSE (THERMAL RESPONSE) 0.1 ...

Page 6

-3.0A 0.09 0.08 0.07 4.0 6.0 8.0 10.0 12.0 -V GS, Gate -to -Source Voltage (V) Fig 11. Typical On-Resistance Vs. Gate Voltage Charge ...

Page 7

Temperature ( °C ) Fig 14. Threshold Voltage Vs. Temperature www.irf.com PROVISIONAL -250µ 0.001 75 100 125 150 0.010 0.100 1.000 ...

Page 8

TM Micro3 Package Outline 0.10 (.004 NOTES: 1. DIMENSIONING & TOLERANCING PER ...

Page 9

TM Micro3 Notes : T his part marking information applies to devices produced before 02/26/2001 EXAMPLE: T HIS IS AN IRLML6302 PART NUMBER PART NUMBER CODE REFERENCE IRLML2402 1B = IRLML2803 1C = IRLML6302 1D = IRLML5103 1E ...

Page 10

TM Micro3 Tape & Reel Information 2.05 ( .080 ) 1.95 ( .077 ) 4.1 ( .161 ) 3.9 ( .154 ) TR FEED DIRECTION 178.00 ( 7.008 ) MAX. NOTES: 1. CONTROLLING DIMENSION : MILLIMETER. 2. OUTLINE CONFORMS TO ...

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