74AHC125D,112 NXP Semiconductors, 74AHC125D,112 Datasheet
74AHC125D,112
Specifications of 74AHC125D,112
74AHC125D
935262762112
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74AHC125D,112 Summary of contents
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Quad buffer/line driver; 3-state Rev. 04 — 11 January 2008 1. General description The 74AHC125; 74AHCT125 is a high-speed Si-gate CMOS device and is pin compatible with Low-power Schottky TTL (LSTTL). They are specified in compliance with JEDEC ...
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... NXP Semiconductors 4. Functional diagram 1OE 2OE 3OE 4OE 13 mna228 Fig 1. Logic symbol 5. Pinning information 5.1 Pinning 74AHC125 74AHCT125 1OE 2OE GND 7 001aae755 Fig 4. Pin configuration SO14 and TSSOP14 74AHC_AHCT125_4 Product data sheet 74AHC125; 74AHCT125 EN1 mna229 Fig 2. IEC logic symbol ...
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... NXP Semiconductors 5.2 Pin description Table 2. Pin description Symbol Pin Description 1OE 1 output enable input (active LOW data input 1Y 3 data output 2OE 4 output enable input (active LOW data input 2Y 6 data output GND 7 ground ( data output 3A 9 data input 3OE ...
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... NXP Semiconductors Table 4. Limiting values …continued In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter T storage temperature stg P total power dissipation tot SO14 package TSSOP14 package DHVQFN14 package [1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed. ...
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... NXP Semiconductors Table 6. Static characteristics …continued Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions V HIGH-level output voltage 4.0 mA 8.0 mA LOW-level output voltage 4.0 mA 8.0 mA OFF-state output current GND 5 input leakage GND current 5 supply current GND 5 input I capacitance C output O capacitance ...
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... NXP Semiconductors Table 6. Static characteristics …continued Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions I additional per input pin; CC supply current other pins 4 5 input I capacitance C output O capacitance 10. Dynamic characteristics Table 7. Dynamic characteristics GND = 0 V; For test circuit see Figure Symbol Parameter ...
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... NXP Semiconductors Table 7. Dynamic characteristics GND = 0 V; For test circuit see Figure Symbol Parameter Conditions For type 74AHCT125 t propagation nA to nY; see pd delay enable time nOE to nY; see 4 5 disable time nOE to nY; see dis power pF dissipation V = GND capacitance [1] Typical values are measured at nominal supply voltage (V ...
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... NXP Semiconductors nOE input output LOW-to-OFF OFF-to-LOW output HIGH-to-OFF OFF-to-HIGH Measurement points are given in V and V are typical voltage output levels that occur with the output load Fig 7. Enable and disable times Table 8. Measurement points Type Input V M 74AHC125 0.5V CC 74AHCT125 1 ...
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... NXP Semiconductors negative positive PULSE GENERATOR Test data is given in Table 9. Definitions test circuit Termination resistance should be equal to output impedance Load capacitance including jig and probe capacitance Load resistance Test selection switch. Fig 8. Load circuit for switching times Table 9. Test data ...
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... NXP Semiconductors 12. Package outline SO14: plastic small outline package; 14 leads; body width 3 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.069 0.01 0.004 0.049 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... NXP Semiconductors TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 0.95 mm 1.1 0.25 0.05 0.80 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. ...
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... NXP Semiconductors DHVQFN14: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; body 2 0.85 mm terminal 1 index area terminal 1 index area DIMENSIONS (mm are the original dimensions) (1) A (1) UNIT max. 0.05 0.30 3 0.2 0.00 0.18 2.9 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. ...
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... Document ID Release date 74AHC_AHCT125_4 20080111 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Section • Section • ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 17. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Functional description . . . . . . . . . . . . . . . . . . . 3 7 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 6 11 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 13 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 13 14 Revision history ...