STPCI01 STMicroelectronics, STPCI01 Datasheet - Page 60

• Manufacturer Part Number: STPCI01
• Description: STPC INDUSTRIAL - PC COMPATIBLE EMBEDED MICROPROC
• Manufacturer: STMicroelectronics

MECHANICAL DATA
5.2. 388-PIN PACKAGE THERMAL DATA
The 388-pin PBGA package has a Power
Dissipation Capability of 4.5W. This increases to
6W when used with a Heatsink.
60/69
Board
Signal layers
Ambient
Case
Junction
Board
Ambient
Figure 5-5. Thermal Dissipation Without Heatsink
Rca
Rjc
Rjb
Rba
Figure 5-4. 388-Pin PBGA structure
Board
Issue 2.4 - February 11, 2002
8.5
Rja = 13 °C/W
6
Junction
Ambient
Thermal balls
6
125
Case
The structure in shown in
Thermal dissipation options are illustrated in
Figure 5-5
Board dimensions:
- 10.2 cm x 12.7 cm
- 4 layers (2 for signals, 1 GND, 1VCC)
The PBGA is centred on board
There are no other devices
1 via pad per ground ball (8-mil wire)
40% copper on signal layers
Copper thickness:
- 17µm for internal layers
- 34µm for external layers
Airflow = 0
Board temperature taken at the centrecentre ba
and
Figure
Power & Ground layers
5-6.
Figure
5-4.