NLU2G17AMX1TCG ON Semiconductor, NLU2G17AMX1TCG Datasheet - Page 5

• Manufacturer Part Number: NLU2G17AMX1TCG
• Description: IC BUFF SCHM TRG DL N-INV 6ULLGA
• Manufacturer: ON Semiconductor

Specifications of NLU2G17AMX1TCG

• Logic Type: Schmitt Trigger - Buffer, Driver
• Number Of Elements: 2
• Number Of Bits Per Element: 1
• Current - Output High, Low: 8mA, 8mA
• Voltage - Supply: 1.65 V ~ 5.5 V
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 6-ULLGA
• Number Of Channels Per Chip: 2
• Polarity: Non-Inverting
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 1.65 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: Screw
• High Level Output Current: - 8 mA
• Low Level Output Current: 8 mA
• Minimum Operating Temperature: - 55 C
• Number Of Lines (input / Output): 2 / 2
• Propagation Delay Time: 16.3 ns at 3 V to 3.6 V, 10.6 ns at 4.5 V to 5.5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

6X
10X
2X
b
REFERENCE
0.10
0.05
0.10 C
PIN ONE
2X
0.10 C
0.08 C
C
C
NOTE 3
A
0.10 C
L2
B
É É
É É
É É
BOTTOM VIEW
SIDE VIEW
TOP VIEW
1
6
D
3
4
A1
e
A
B
E
(A3)
5X
L
A
C
PACKAGE DIMENSIONS
EXPOSED Cu
SEATING
PLANE
UDFN6, 1.2x1.0, 0.4P
http://onsemi.com
A1
CASE 517AA−01
L1
ISSUE C
Bottom View
É É É
É É É
(Optional)
DETAIL A
(Optional)
Side View
DETAIL B
5
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
EDGE OF PACKAGE
MOLD CMPD
PITCH
0.40
MOUNTING FOOTPRINT*
A3
0.42
6X
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
4. COPLANARITY APPLIES TO THE EXPOSED
ASME Y14.5M, 1994.
AND IS MEASURED BETWEEN 0.25 AND
0.30 mm FROM TERMINAL.
PAD AS WELL AS THE TERMINALS.
DIM
A1
A3
L1
L2
A
D
b
E
e
L
MILLIMETERS
MIN
0.45
0.00
0.15
0.30
0.00
0.40
0.127 REF
1.20 BSC
1.00 BSC
0.40 BSC
DIMENSIONS: MILLIMETERS
MAX
0.55
0.05
0.25
0.40
0.15
0.50
1.07
0.22
6X