NLU2G07CMX1TCG ON Semiconductor, NLU2G07CMX1TCG Datasheet - Page 7
![IC BUFF DL OP/DRAIN N-INV 6ULLGA](/photos/7/8/70897/6-ullga_613ad_sml.jpg)
NLU2G07CMX1TCG
Manufacturer Part Number
NLU2G07CMX1TCG
Description
IC BUFF DL OP/DRAIN N-INV 6ULLGA
Manufacturer
ON Semiconductor
Datasheet
1.NLU2G07MUTCG.pdf
(8 pages)
Specifications of NLU2G07CMX1TCG
Logic Type
Buffer/Line Driver, Non-Inverting
Number Of Elements
2
Number Of Bits Per Element
1
Voltage - Supply
1.65 V ~ 5.5 V
Operating Temperature
-55°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
6-ULLGA
Number Of Channels Per Chip
2
Polarity
Non-Inverting
Supply Voltage (max)
5.5 V
Supply Voltage (min)
1.65 V
Maximum Operating Temperature
+ 125 C
Mounting Style
Screw
Low Level Output Current
8 mA
Minimum Operating Temperature
- 55 C
Number Of Lines (input / Output)
2 / 2
Output Type
Open Drain
Propagation Delay Time
10.6 ns at 3 V to 3.6 V, 7.5 ns at 4.5 V to 5.5 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Current - Output High, Low
-
Lead Free Status / Rohs Status
Details
6X
REFERENCE
PIN ONE
0.10 C
0.05 C
0.05 C
0.10 C
L1
É É
É É É É
BOTTOM VIEW
SIDE VIEW
TOP VIEW
1
6
D
4
A1
3
e
6X
E
A
B
A
b
5X
0.10
0.05
C
L
SEATING
PLANE
NOTE 4
C
C
PACKAGE DIMENSIONS
A
NOTE 3
ULLGA6 1.2x1.0, 0.4P
B
http://onsemi.com
CASE 613AE-01
NLU2G07
ISSUE A
7
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.53
SOLDERMASK DEFINED*
MOUNTING FOOTPRINT
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
4. A MAXIMUM OF 0.05 PULL BACK OF THE
OUTLINE
ASME Y14.5M, 1994.
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
PLATED TERMINAL FROM THE EDGE OF THE
PACKAGE IS ALLOWED.
PKG
DIM
0.49
A1
L1
A
D
E
b
e
L
5X
1
MILLIMETERS
MIN
0.00
0.15
0.25
0.35
---
1.20 BSC
1.00 BSC
0.40 BSC
DIMENSIONS: MILLIMETERS
MAX
0.40
0.05
0.25
0.35
0.45
PITCH
1.24
0.40
0.26
6X