MC74LVX50DTG ON Semiconductor, MC74LVX50DTG Datasheet - Page 3
![IC BUFFER HEX NON-INVERT 14TSSOP](/photos/16/14/161484/tssop14_sml.jpg)
MC74LVX50DTG
Manufacturer Part Number
MC74LVX50DTG
Description
IC BUFFER HEX NON-INVERT 14TSSOP
Manufacturer
ON Semiconductor
Series
74LVXr
Specifications of MC74LVX50DTG
Logic Type
Buffer/Line Driver, Non-Inverting
Number Of Elements
6
Number Of Bits Per Element
1
Current - Output High, Low
4mA, 4mA
Voltage - Supply
2 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
14-TSSOP
Circuit Type
Silicon Gate
Current, Supply
20 μA
Function Type
3-Stages
Logic Function
Buffer
Number Of Circuits
Hex
Package Type
TSSOP-14
Special Features
Buffered Output
Temperature, Operating, Range
-40 to +85 °C
Voltage, Supply
2 to 3.6 V
Logic Family
LVX
Number Of Channels Per Chip
5
Polarity
Non-Inverting
Supply Voltage (max)
3.6 V
Supply Voltage (min)
2 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
High Level Output Current
- 4 mA
Low Level Output Current
4 mA
Maximum Power Dissipation
200 mW
Minimum Operating Temperature
- 40 C
Number Of Lines (input / Output)
6 / 6
Propagation Delay Time
13.6 ns at 2.7 V, 9.7 ns at 3.3 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA/JESD78.
6. Unused inputs may not be left open. All inputs must be tied to a high− or low−logic input voltage level.
NOTE:
RECOMMENDED OPERATING CONDITIONS
MAXIMUM RATINGS
Symbol
Symbol
I
Latchup
Dt/DV
V
T
V
I
MSL
V
V
V
I
OUT
I
q
F
V
OUT
I
STG
T
T
OK
CC
T
ESD
V
CC
IK
CC
JA
IN
A
L
R
O
J
I
The q
and figure below.
DC Supply Voltage
DC Input Voltage
DC Output Voltage
DC Input Diode Current
DC Output Diode Current
DC Output Sink Current
DC Supply Current per Supply Pin
Storage Temperature Range
Lead Temperature, 1 mm from Case for 10 Seconds
Junction Temperature under Bias
Thermal Resistance
Moisture Sensitivity
Flammability Rating
ESD Withstand Voltage
Latchup Performance
Supply Voltage
Input Voltage
Output Voltage
Operating Free−Air Temperature
Input Transition Rise or Fall Rate
JA
of the package is equal to 1/Derating. Higher junction temperatures may affect the expected lifetime of the device per the table
Parameter
Parameter
Above V
CC
MC74LVX50
and Below GND at 85_C (Note 5)
Charged Device Model (Note 4)
Human Body Model (Note 2)
3
Oxygen Index: 30% − 35%
Machine Model (Note 3)
(HIGH or LOW State)
V
CC
= 3.0 V $0.3 V
V
V
O
(Note 6)
I
(Note 1)
TSSOP
< GND
< GND
SOIC
UL 94−V0 @ 0.125 in
*40
Min
*0.5 to V
2.0
0
0
0
*0.5 to )7.0
*0.5 to )7.0
*65 to )150
Level 1
> 2000
)150
$300
Value
> 200
2000
*20
$20
$25
$50
260
125
170
CC
)0.5
)85
Max
V
100
3.6
5.5
CC
_C/W
Unit
Unit
ns/V
mA
mA
mA
mA
mA
_C
_C
_C
_C
V
V
V
V
V
V
V