S1D12200 Epson Electronics America, Inc., S1D12200 Datasheet - Page 12

• Manufacturer Part Number: S1D12200
• Description: S1d12000 Series Lcd Driver Ic Technical Manual Technical Manual
• Manufacturer: Epson Electronics America, Inc.

4. CHIP SPECIFICATION
S1D12200D
1) A1 pad specifications
2) Au bump specifications
<Fuse Pines>
1) Al pad. pad size
2) Au bump
Rev. 1.4
147
165
Pad size on Y side:
Pad size on X side:
Bump size on Y side:
Bump size on X side:
Bump height (for reference)
146
1
S1D122
Bump size
Chip size:
Pad pitch:
Chip thickness (for reference): 625
****
Digits prepared for CGROM pattern changes
**
D
/S1D12201D
****
****
7.70
22.5 m
100 m (Minimum)
135 m
129 m
/S1D12210D
75 m 135 m
69 m 129 m
86 m
80 m
2.77 mm
25 m (S1D122
EPSON
5.5 m
75 m
69 m
75 m
69 m
Top View
(S1D122
****
y
**
**
x
D
D
**
**
A
B
*
*
)
)
:DUMY PAD
:PAD
S1D12200 Series
74
54
2–3
73
63
62
56
55