DDB2503-000 Skyworks Solutions, Inc., DDB2503-000 Datasheet - Page 3

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DDB2503-000

Manufacturer Part Number
DDB2503-000
Description
Silicon Schottky Barrier Diodes Packaged, Bondable Chips And Beam-leads
Manufacturer
Skyworks Solutions, Inc.
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DDB2503-000
Manufacturer:
Skyworks
Quantity:
1 400
Part Number:
DDB2503-000LF
Manufacturer:
Skyworks
Quantity:
1 400
N-Type Detector Schottky Diode Chips
SPICE Model Parameters
Hermetic Packaged P-Type Detector Schottky Diode Chips
Hermetic Packaged Beam-Lead N-Type Detector Schottky Diode Chips
Parameter Unit
C
Frequency
X
FC
I
R
T
E
V
B
m
I
BV
n
S
J0
D
G
TI
S
J
V
Band
Ku
Ku
X
K
K
pF
eV
W
A
A
s
V
V
hermetic ceramic Pill
CME7660-207
cDF7620-000 cDF7621-000 cDc7623-000 cDB7619-000
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
CDB7620-207
CDB7619-207
CDF7623-207
CDF7621-207
CDE7618-207
CDP7624-207
200847 Rev. A • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • October 3, 2008
Hermetic Pill
4e–08
1e–11
1e–05
CME7660–000
0.495
CDF7623–000
CDF7621–000
CDE7618–000
CDP7624–000
0.15
0.35
0.69
1.2
0.5
207
207
10
4
2
number
Part
9e–08
1e–11
1e–05
0.11
0.69
0.51
1.1
0.3
0.5
2.5
6
2
Part number
Data Sheet • Silicon Schottky Barrier DioDeS: PackageD, BonDaBle chiPS anD Beam-leaDS
Med/High
Barrier
Med
Med
Low
Low
1.1e–7
1e–11
1e–05
0.69
0.51
1.1
0.2
0.3
0.5
2.5
5
2
240–300
350–450
375–500
450–575
@ 1 ma
270–350
3e–08
1e–11
1e–05
1.04
0.11
0.32
0.69
0.54
(mv)
0.5
30
2
3
V
hermetic ceramic Pill
F
CDB7620-203
CDB7619-203
CME7660-203
CDF7623-203
CDF7621-203
CDE7618-203
CDP7624-203
Hermetic Pill
203
203
Shipping Information
Individual Chips
Standard packaging procedures at Skyworks are for “waffle
pack” delivery. Devices can also be packaged on “Gel Pack”
carriers.
Wafer Shipment for Whole Wafer
Packaging options include delivery for devices on film frame
where wafer is sawn on wafer gel pack for uncut, unsawn wafer.
max. c
electrical characteristics
0.30
0.10
0.15
0.10
0.15
(pF)
J
@ 0V
@ 10 ma
max. r
(W)
10
20
10
20
15
t
hermetic Surface mount
@ 10 µa
min. V
SMS7620-109
SMS7619-109
SMS7623-108
SMS7621-108
SMS7660-108
SMS7618-108
SMS7624-108
(V)
Hermetic
2
2
3
3
3
109
108
B
Drawing
571-011
571-011
571-011
571-011
571-011
number
outline
3

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