MC74HC541ADTG ON Semiconductor, MC74HC541ADTG Datasheet - Page 8

• Manufacturer Part Number: MC74HC541ADTG
• Description: IC BUFF/DVR TRI-ST 8BIT 20TSSOP
• Manufacturer: ON Semiconductor
• Series: 74HCr

Specifications of MC74HC541ADTG

• Logic Type: Buffer/Line Driver, Non-Inverting
• Number Of Elements: 1
• Number Of Bits Per Element: 8
• Current - Output High, Low: 7.8mA, 7.8mA
• Voltage - Supply: 2 V ~ 6 V
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 20-TSSOP
• Logic Family: 74HC
• Number Of Channels Per Chip: Octal
• Polarity: Non-Inverting
• Supply Voltage (max): 6 V
• Supply Voltage (min): 2 V
• Maximum Operating Temperature: 125 C
• Mounting Style: SMD/SMT
• High Level Output Current: - 7.8 mA
• Input Bias Current (max): 4 uA
• Low Level Output Current: 7.8 mA
• Maximum Power Dissipation: 450 mW
• Minimum Operating Temperature: - 55 C
• Number Of Lines (input / Output): 3
• Output Type: 3-State
• Propagation Delay Time: 80 ns @ 2 V or 30 ns @ 3 V or 18 ns @ 4.5 V or 15 ns @ 6 V
• Logic Device Type: Buffer / Line Driver / Line Receiver, Non Inverting
• Supply Voltage Range: 2V To 6V
• Logic Case Style: TSSOP
• No. Of Pins: 20
• Operating Temperature Range: -55°C To +125°C
• Svhc: No SVHC
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

0.15 (0.006) T
0.15 (0.006) T
L
2X
−T−
U
PIN 1
IDENT
U
L/2
C
0.100 (0.004)
S
S
SEATING
PLANE
20
1
D
0.36
16X
20X
−V−
0.10 (0.004)
A
K
REF
G
H
M
10
11
T
SOLDERING FOOTPRINT
PACKAGE DIMENSIONS
1
U
1.26
16X
−U−
http://onsemi.com
S
B
CASE 948E−02
V
DT SUFFIX
TSSOP−20
ISSUE C
S
7.06
N
8
J J1
N
DETAIL E
Í Í Í Í
Í Í Í Í
Í Í Í Í
DETAIL E
SECTION N−N
F
0.25 (0.010)
K1
K
DIMENSIONS: MILLIMETERS
M
−W−
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
4. DIMENSION B DOES NOT INCLUDE
5. DIMENSION K DOES NOT INCLUDE DAMBAR
6. TERMINAL NUMBERS ARE SHOWN FOR
7. DIMENSION A AND B ARE TO BE
PITCH
0.65
ANSI Y14.5M, 1982.
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
REFERENCE ONLY.
DETERMINED AT DATUM PLANE −W−.
DIM
J1
K1
A
B
C
D
G
H
K
M
F
J
L
MILLIMETERS
MIN
6.40
4.30
0.05
0.50
0.27
0.09
0.09
0.19
0.19
---
0
0.65 BSC
6.40 BSC
_
MAX
6.60
4.50
1.20
0.15
0.75
0.37
0.20
0.16
0.30
0.25
8
_
0.252
0.169
0.002
0.020
0.004
0.004
0.007
0.007
0.011
MIN
---
0
0.026 BSC
0.252 BSC
INCHES
_
MAX
0.260
0.177
0.047
0.006
0.030
0.015
0.008
0.006
0.012
0.010
8
_