CMF-SD Bourns, Inc., CMF-SD Datasheet - Page 2

• Manufacturer Part Number: CMF-SD
• Description: Cmf-sd Series - Telecom Cptc Resettable Fuses
• Manufacturer: Bourns, Inc.

Coplanarity:
(Reduced value available on request.)
Packaging Options - Tape and Reel:
CMF-SD25, CMF-SD35 & CMF-SD50 = 400 pcs. per reel;
CMF-SD35A & CMF-SD50A = 500 pcs. per reel
Solder reflow
• Recommended reflow methods: IR, vapor phase oven, hot air oven.
• Devices are not designed to be wave soldered to the bottom side of the board.
• Gluing the devices is not recommended.
• Recommended maximum paste thickness is 0.25 mm (.010 inch).
• Devices can be cleaned using standard industry methods and solvents.
Note:
• If reflow temperatures exceed the recommended profile, devices may not meet the performance
Rework
• A device should not be reworked.
H
Product Dimensions
requirements.
Solder Reflow Recommendations
DIMENSIONS =
300
250
200
150
100
50
0
CMF-SD Series - Telecom CPTC Resettable Fuses
F
A
(.006)
0.15
(INCHES)
MM
Preheating
160–220
B
G
Time (seconds)
D
E
C
Soldering
10–20
Dim.
Cooling
C
D
G
H
A
B
E
F
120
CMF-SD25
CMF-SD35
CMF-SD50
(.192 - .208)
(.095 - .103)
(.020)
(.354)
10.80
(.425)
10.20
(.402)
4.88 - 5.28
2.41 - 2.61
9.00
0.5
(.098)
(.039)
2.5
1.0
MAX.
MAX.
MAX.
MAX.
CMF-SD35A
CMF-SD50A
(.128 - .144)
(.095 - .103)
Customers should verify actual device performance in their specific applications.
3.25 - 3.65
2.41 - 2.61
(.281)
(.335)
(.319)
(.020)
7.15
8.50
8.10
0.5
(.098)
(.039)
2.5
1.0
MAX.
MAX.
MAX.
MAX.
Recommended Pad Layout
A
Specifications are subject to change without notice.
Dim.
A
B
C
D
E
G
H
F
Tel: [phone]
Fax: [phone]
Tel: [phone]
Fax: [phone]
Tel: [phone]
Fax: [phone]
Asia-Pacific:
Europe:
The Americas:
www.bourns.com
1
3
3
1
CMF-SD25
CMF-SD35
CMF-SD50
(.394)
(.346)
(.126)
(.079)
(.102)
(.197)
(.299)
(.394)
10.0
8.80
3.20
2.00
2.60
5.00
7.60
10.0
B
H
C
CMF-SD SERIES, REV. M, 11/08
2
4
CMF-SD35A
CMF-SD50A
D
(.079)
(.099)
(.136)
(.234)
(.321)
(.315)
(.278)
(.108)
2.00
2.51
3.45
5.95
8.15
8.00
7.05
2.75
2
4
E
F
G