NGPBR70ASS NICHIA CORPORATION, NGPBR70ASS Datasheet - Page 6

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NGPBR70ASS

Manufacturer Part Number
NGPBR70ASS
Description
Nichia Blue Led
Manufacturer
NICHIA CORPORATION
Datasheet
(3) Soldering Conditions
(4) Cleaning
· Nichia LEDs uses a copper alloy lead frame which provides a high thermal conductivity.
· Solder the LED no closer than 1.6mm from the base of the stopper.
· The mechanical stress by clinching will cause degradation of the reliability on the LEDs. It is
· Recommended soldering conditions
· Although the recommended soldering conditions are specified in the above table, dip or hand
· A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.
· Dip soldering should not be done more than one time.
· Hand soldering should not be done more than one time.
· Do not apply any stress to the lead particularly when heated.
· The LEDs must not be repositioned after soldering.
· After soldering the LEDs, the epoxy bulb should be protected from mechanical shock or vibration until
· Direct soldering onto a PC board should be avoided.
· When it is necessary to clamp the LEDs to prevent soldering failure, it is important to minimize
· Cut the LED leadframes at room temperature.
· It is recommended that isopropyl alcohol be used as a solvent for cleaning the LEDs. When using
· Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic
stress such as soldering heat may reduce the reliability of the product; particular caution should be
used to avoid damage prior to and during soldering.
listed in the following table.
important to minimize the mechanical stress on the LEDs.
that it will not cause any problem when using it.
soldering at the lowest possible temperature is desirable for the LEDs.
the LEDs return to room temperature.
from warping of the PC board or from the clinching and cutting of the leadframes.
absolutely necessary, the LEDs may be mounted in this fashion but the User will assume responsibility
directly to double sided PC boards because the heat will deteriorate the epoxy resin.
the mechanical stress on the LEDs.
cause failure of the LEDs.
other solvents, it should be confirmed beforehand whether the solvents will dissolve the resin or not.
Freon solvents should not be used to clean the LEDs because of worldwide regulations.
cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition.
Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur.
for any problems.
such as wire bond failure or resin deterioration, will occur.
Pre-Heat
Pre-Heat Time
Solder Bath
Dipping Time
Dipping Position
Temperature
Direct soldering should only be done after testing has confirmed that no damage,
Dip Soldering
120°C Max.
60 seconds Max.
260°C Max.
5 seconds Max.
No lower than 1.6 mm from the
base of the stopper.
-5-
Cutting the leadframes at high temperatures may
Temperature
Soldering Time
Position
The recommended soldering conditions are
Mechanical stress to the resin may be caused
It should be confirmed beforehand
Nichia’s LEDs should not be soldered
Hand Soldering
350°C Max.
3 seconds Max.
No closer than 1.6 mm from the
base of the stopper.
Nichia STSE-CB7115A
When it is
<Cat.No.070626>
Thermal

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