MCRF200 Microchip Technology Inc., MCRF200 Datasheet

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MCRF200

Manufacturer Part Number
MCRF200
Description
125 Khz Microid? Passive Rfid Device
Manufacturer
Microchip Technology Inc.
Datasheet
Features
• Factory programming and memory serialization
• One-time contactless programmable (developer
• Read-only data transmission after programming
• 96 or 128 bits of One-Time Programmable (OTP)
• Typical operation frequency: 100 kHz-400 kHz
• Ultra low-power operation (5 A @ V
• Modulation options:
• Data Encoding options:
• Die, wafer, COB, PDIP or SOIC package options
• Factory programming options
Application
• Low-cost alternative for existing low-frequency
• Access control and time attendance
• Security systems
• Animal tagging
• Product identification
• Industrial tagging
• Inventory control
¤ 2003 Microchip Technology Inc.
(SQTP
kit only)
user memory (also supports 48 and 64-bit
protocols)
- ASK, FSK, PSK
- NRZ Direct, Differential Biphase, Manchester
RFID devices
Biphase
Reader
SM
)
125 kHz microID™ Passive RFID Device
Signal
Data
RF
CC
= 2V)
MCRF200
Package Type
Description
The MCRF200 is a passive Radio Frequency Identifi-
cation (RFID) device for low-frequency applications
(100 kHz-400 kHz). The device is powered by
rectifying an incoming RF signal from the reader. The
device requires an external LC resonant circuit to
receive the incoming RF signal and to send data. The
device develops a sufficient DC voltage for operation
when its external coil voltage reaches approximately 10
V
This device has a total of 128 bits of user programmable
memory and an additional 12 bits in its configuration
register. The user can manually program the 128 bits of
user memory by using a contactless programmer in a
microID developer kit such as DV103001 or PG103001.
However, in production volume the MCRF200 is
programmed at the factory (Microchip SQTP – see
Technical Bulletin TB023). The device is a One-Time
Programmable (OTP) integrated circuit and operates as
a read-only device after programming.
Note: Pins 3, 4, 5 and 6 are for device test purposes only.
PP
PDIP/SOIC
.
Pins 1 and 8 are for antenna connections.
DO NOT ground pin 5.
RESET
MCRF200
NC
I/O
V
A
1
2
3
4
8
7
6
5
DS21219H-page 1
V
NC
V
V
B
SS
CC

Related parts for MCRF200

MCRF200 Summary of contents

Page 1

... Pins 1 and 8 are for antenna connections. DO NOT ground pin 5. = 2V) CC Description The MCRF200 is a passive Radio Frequency Identifi- cation (RFID) device for low-frequency applications (100 kHz-400 kHz). The device is powered by rectifying an incoming RF signal from the reader. The device requires an external LC resonant circuit to receive the incoming RF signal and to send data ...

Page 2

... MCRF200 Block Diagram Coil Connections The configuration register includes options for commu- nication protocol (ASK, FSK, PSK), data encoding method, data rate, and data length.These options are specified by customer and factory programmed during assembly. Because of its many choices of configuration options, the device can be easily used as an alternative or second source for most of the existing low frequency passive RFID devices available today ...

Page 3

... CLK T — 2 — WC 200 — — I — — — — — — — 2 — IN MCRF200 Units Conditions kHz sec For all 128-bit array Years at 25° Between V and DS21219H-page 3 ...

Page 4

... AM-modulating the coil voltage across the tuned LC circuit. A modulation transistor is placed between the two antenna coil pads (V on and off based on the modulation signal result, the amplitude of the antenna coil voltage varies with the modulation signal. See Figure 2-1 for details. MCRF200 V A Modulation Signal L ...

Page 5

... The PSK_2 represents change in the phase at the change on ‘1’. For example, the phase changes when the encoded data is changed from ‘0’ to ‘1’, or from ‘1’ to ‘1’. Encoded Data ‘0’ 4 cycles (HI) 4 cycles (LO cycles MCRF200 lower lower DS21219H-page 5 ...

Page 6

... MOD50 (baud rate = rf/50), 96 bits. EXAMPLE 2-3: The FDX-B ISO Specification is: Modulation = ASK Data encoding = Differential biphase Baud rate = rf/ Kbits/sec for 128 kHz Memory size = 128 bits Referring to Table 2-4, the equivalent MCRF200 configuration is: “14D”. ‘1’ Encoded Data (NRZ_L) PSK_ 1 Change on Data ...

Page 7

... TABLE 2-4: CONFIGURATION REGISTER CB12 CB11 CB10 CB9 CB8 CB7 CB6 CB5 CB4 CB3 CB2 CB1 ¤ 2003 Microchip Technology Inc. MCRF200 MEMORY SIZE CB1 = 1 128-bit user memory array CB1 = 0 96-bit user memory array BAUD RATE CB2 CB3 CB4 Rate MOD128 ...

Page 8

... F /128, FSK, NRZ_L (direct) CLK Once the user memory is programmed, the lock bit is set (CB12=1) which causes the MCRF200 to switch from Native mode to the Communication mode defined by the configuration register. Refer to Figure 4-1 for contactless programming ™ sequence. Also see the microID System Design Guide (DS51115) for more information ...

Page 9

... PROGRAMMING The contactless programming of the device is possible for blank devices (CB12=0) only and is recommended for only low-volume, manual operation during develop- ment. In volume production, the MCRF200 is normally used as a factory programmed device only. The contactless programming timing sequence consists of power-up signal. ...

Page 10

... MCRF200 FIGURE 4-1: CONTACTLESS PROGRAMMING SEQUENCE DS21219H-page 10 ¤ 2003 Microchip Technology Inc. ...

Page 11

... Note 1: All coordinates are referenced from the center of the die. 2: Die size: 1.1215 mm x 1.7384 mm TABLE 5-2: Name RESET I MCRF200 PAD COORDINATES ( m) Openings Pad Pad Pad Height Center X Center Y 90.0 427.50 -734.17 90.0 -408.60 -734.17 44.15 mils x 68.44 mils PAD FUNCTION TABLE ...

Page 12

... MCRF200 TABLE 5-3: DIE MECHANICAL DIMENSIONS Specifications Bond pad opening Die backgrind thickness Die backgrind thickness tolerance Die passivation thickness (multilayer) Die Size: Die size X*Y before saw (step size) Die size X*Y after saw Note 1: The bond pad size is that of the passivation opening. The metal overlaps the bond pad passivation by at least 0 ...

Page 13

... Total number of good dice in the container • Average die per wafer (DPW) • Scribe number of wafers with number of good dice ¤ 2003 Microchip Technology Inc. MCRF200 8.0 NOTICE ON DIE AND WAFER HANDLING The device is very susceptible to Electrostatic Discharge (ESD). ESD can cause critical damage to the device ...

Page 14

... Standard device marking consists of Microchip part number, year code, week code, and traceability code. DS21219H-page 14 Example: MCRF200 XXXXXNNN 0025 Example: MCRF200 XXX0025 NNN ¤ 2003 Microchip Technology Inc. ...

Page 15

... A2 .115 .130 .145 A1 .015 E .300 .313 .325 E1 .240 .250 .260 D .360 .373 .385 L .125 .130 .135 c .008 .012 .015 B1 .045 .058 .070 B .014 .018 .022 § eB .310 .370 .430 MCRF200 MILLIMETERS MIN NOM MAX 8 2.54 3.56 3.94 4.32 2.92 3.30 3.68 0.38 7.62 7.94 8.26 6.10 6.35 6.60 9.14 9.46 9.78 3.18 3.30 3.43 0.20 0.29 0.38 1.14 1.46 1.78 0.36 0.46 0.56 7.87 9.40 10. ...

Page 16

... MCRF200 8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC 45° c UNITS DIMENSION LIMITS Number of Pins Pitch Overall Height Molded Package Thickness Standoff § Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Lead Thickness ...

Page 17

... COB (IOA2) ¤ 2003 Microchip Technology Inc. MCRF200 COB 5 mm Thickness = 0.4 mm MCRF200 DS21219H-page 17 ...

Page 18

... MCRF200 NOTES: DS21219H-page 18 ¤ 2003 Microchip Technology Inc. ...

Page 19

... Microchip's development systems software products. Plus, this line provides information on how customers ® ® can receive the most current upgrade kits. The Hot Line or Microsoft Numbers are: 1-800-755-2345 for U.S. and most of Canada, and 1-480-792-7302 for the rest of the world. MCRF200 042003 DS21219H-page 19 ...

Page 20

... Telephone: (_______) _________ - _________ Application (optional): Would you like a reply? Y Device: MCRF200 Questions: 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs you find the organization of this document easy to follow? If not, why? 4 ...

Page 21

... PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office PART NO. X /XX Device Temperature Package Range Device MCRF200 = 125 kHz Contactless Programmable MicroID™ tag, 96/128-bit Temperature Range +85 C Package WF = Sawed wafer on frame (7 mil backgrind) ...

Page 22

... MCRF200 NOTES: DS21219H-page 22 ¤ 2003 Microchip Technology Inc. ...

Page 23

... Use of Microchip’s products as critical com- ponents in life support systems is not authorized except with express written approval by Microchip. No licenses are con- veyed, implicitly or otherwise, under any intellectual property rights. ¤ 2003 Microchip Technology Inc. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC ...

Page 24

... Via Quasimodo, 12 20025 Legnano (MI) Milan, Italy Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands Biesbosch 14 NL-5152 SC Drunen, Netherlands Tel: 31-416-690399 Fax: 31-416-690340 United Kingdom 505 Eskdale Road Winnersh Triangle Wokingham Berkshire, England RG41 5TU Tel: 44-118-921-5869 Fax: 44-118-921-5820 11/24/03 ¤ 2003 Microchip Technology Inc. ...

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