DSPIC30F6012A Microchip Technology Inc., DSPIC30F6012A Datasheet - Page 237
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DSPIC30F6012A
Manufacturer Part Number
DSPIC30F6012A
Description
Dspic30f6011a/6012a/6013a/6014a High-performance Digital Signal Controllers
Manufacturer
Microchip Technology Inc.
Datasheet
1.DSPIC30F6012A.pdf
(238 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC30F6012A-20E/PF
Manufacturer:
Microchip Technology
Quantity:
10 000
Company:
Part Number:
DSPIC30F6012A-20E/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Company:
Part Number:
DSPIC30F6012A-20I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Company:
Part Number:
DSPIC30F6012A-30I/PF
Manufacturer:
Holtek
Quantity:
175
Company:
Part Number:
DSPIC30F6012A-30I/PF
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
DSPIC30F6012A-30I/PF
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
Company:
Part Number:
DSPIC30F6012A-30I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
DSPIC30F6012A-30I/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
Part Number:
DSPIC30F6012AT-20E/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
Part Number:
DSPIC30F6012AT-30E/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
Part Number:
DSPIC30F6012AT-30I/PF
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
© 2006 Microchip Technology Inc.
Architecture
Trademark
Example:
dsPIC30F6011AT-30I/PF = 30 MIPS, Industrial temp., TQFP package, Rev. A
Memory Size in Bytes
0 = ROMless
1 = 1K to 6K
2 = 7K to 12K
3 = 13K to 24K
4 = 25K to 48K
5 = 49K to 96K
6 = 97K to 192K
7 = 193K to 384K
8 = 385K to 768K
9 = 769K and Up
Device ID
Flash
dsPIC30F6011A/6012A/6013A/6014A
d s P I C 3 0 F 6 0 11 AT - 3 0 I / P F - E S
Preliminary
Temperature
I = Industrial -40°C to +85°C
E = Extended High Temp -40°C to +125°C
Package
PF = TQFP 14x14
S
W
PT = TQFP 10x10
PT = TQFP 12x12
A,B,C… = Revision Level
Custom ID (3 digits) or
Engineering Sample (ES)
= Die (Waffle Pack)
= Die (Wafers)
T = Tape and Reel
DS70143C-page 235
Speed
30 = 30 MIPS