VSM0805 Vishay, VSM0805 Datasheet - Page 2

• Manufacturer Part Number: VSM0805
• Description: Bulk Metal Foil Technology Discrete Surface Mount Chip Resistors
• Manufacturer: Vishay

*Land Pattern Dimensions (Z, G, X) are per IPC-782A
Document Number: 63061
Revision 17-Aug-04
SALES
• ASIA/JAPAN: [e-mail] • UK/HOLLAND/SCANDANAVIA: [e-mail] • GERMANY/CZECH REPUBLIC/AUSTRIA: [e-mail]
FIGURE 2 - POWER DERATING CURVE
CHIP
SIZE
0805 0.080 (2.03)
TABLE 4 - ORDERING INFORMATION - VSM STYLE CHIP RESISTORS
MODEL
VSM
TABLE 3 - CHIP SIZES AND SPECIFICATIONS in inches (millimeters)
T
• ISRAEL: [e-mail]
±
0.005 (0.13)
125
100
75
50
25
0
L
-75
CHIP SIZE
–55°C
–50
0805
±
–25
Top View
0.050 (1.27) 0.025 (0.64) 0.015 (0.38)
0.005 (0.13) MAXIMUM
L
Ambient Temperature (°C)
0
For technical questions in Asia/Japan/Europe/Africa/Israel, contact [e-mail]
W
+25
RESISTANCE
1K to 12K
W
5 to <1K
RANGE
+50
+70°C
For technical questions in the Americas, contact [e-mail]
+75
• FRANCE/SWITZERLAND/SOUTHERN EUROPE: [e-mail]
T
Example: 10K000 = 10.0K
Rated Power
+100 +125 +150 +175
Discrete Surface Mount Chip Resistors
Example: 249R00 = 249
RESISTANCE VALUE
±
DESIGNATOR
0.005 (0.13)
Bulk Metal
T
LETTER
D
R
K
POWER MAXIMUM RESISTANCE MAXIMUM
+ 70
(mW)
D
50
®
°
C VOLTAGE
Bottom View
MULTIPLIER
Foil Technology
FACTOR
x 10
(V)
22
x 1.0
L
FIGURE 3 - RECOMMENDED MOUNTING
3
W
5.5 - 12K
RANGE
( )
TOLERANCE
T ± 0.01%
Q ± 0.02%
A ± 0.05%
B ± 0.1%
C ± 0.25%
D ± 0.5%
F ± 1.0%
WEIGHT
(mG)
6
25% to 85% of T
±
0.122 (3.10) 0.028 (0.70)
S - Lead (Pb)-free
B - Tin/Lead
Recommended Land Pattern
0.004 (0.10)
TERMINATION
A low profile solder fillet is recommended
to avoid unnecessary stresses along
top edge of metallization. IR and vapor
phase reflow are best. Avoid the use of
cleaning agents which could attack
epoxy resins, which form part of the
resistor construction.
Z
Vishay Foil Resistors
• AMERICAS: [e-mail]
Z*
G
±
0.004 (0.10)
G*
VSM0805
PACKAGING
T = Tape and
W = Waffle
X
www.vishay.com
Reel
PacK
±
0.050 (1.27)
Footprint
0.004 (0.10)
X*
23