APTC60DAM24CT1G Microsemi Corporation, APTC60DAM24CT1G Datasheet - Page 3
APTC60DAM24CT1G
Manufacturer Part Number
APTC60DAM24CT1G
Description
Boost Chopper Super Junction Mosfet Power Module
Manufacturer
Microsemi Corporation
Datasheet
1.APTC60DAM24CT1G.pdf
(7 pages)
Temperature sensor NTC
Thermal and package characteristics
Symbol Characteristic
Torque
Symbol
∆R
SP1 Package outline
V
R
T
∆B/B
B
Wt
T
T
ISOL
R
STG
thJC
25
25/85
C
J
25
/R
25
Junction to Case Thermal Resistance
RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz
Operating junction temperature range
Storage Temperature Range
Operating Case Temperature
Mounting torque
Package Weight
Characteristic
Resistance @ 25°C
T
25
= 298.15 K
See application note 1904 - Mounting Instructions for SP1 Power Modules on www.microsemi.com
(dimensions in mm)
R
T
=
exp
(see application note APT0406 on www.microsemi.com for more information).
⎡
⎢
⎣
B
25
/
85
R
⎛
⎜ ⎜
⎝
25
T
1
25
−
T
1
⎞
⎟ ⎟
⎠
www.microsemi.com
⎤
⎥
⎦
T: Thermistor temperature
R
T
: Thermistor value at T
To heatsink
APTC60DAM24CT1G
T
Transistor
SiC Diode
C
=100°C
M4
2500
Min
Min
-40
-40
-40
2.5
3952
Typ
Typ
50
5
4
Max
0.27
Max
150
125
100
0.8
4.7
80
°C/W
Unit
Unit
N.m
kΩ
°C
%
K
%
V
g
3 – 7