130PG2C HB Electronic Components, 130PG2C Datasheet - Page 5

• Manufacturer Part Number: 130PG2C
• Description: Led Specification
• Manufacturer: HB Electronic Components

ySOLDERING
1) When soldering the lead of LED in a condition that the package is fixed with a panel (See Fig.1),
2) When soldering wire to the lead, work with a Fig (See Fig.2) to avoid stressing the package.
SOLDERING
SOLDERING
be careful not to stress the leads with iron tip.
METHOD
IRON
DIP
Temperature at tip of iron: 260
Soldering iron: 30W or smaller
SOLDERING CONDITIONS
Soldering time: within 5 sec.
Bath temperature: 260±5
Immersion time: with 5 sec
LED LAMP APPLICATION
)LJ
or lower
y Solder no closer than 3mm from the
y Using soldering flux,” RESIN FLUX”
y During soldering, take care not to
(To prevent heat from being
base of the package
is recommended.
press the tip of iron against the
lead.
transferred directly to the lead, hold
the lead with a pair of tweezers
while soldering
) L J  
REMARK
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