MSA-0200 Hewlett-Packard, MSA-0200 Datasheet

no-image

MSA-0200

Manufacturer Part Number
MSA-0200
Description
Cascadable Silicon Bipolar MMIC Amplifier
Manufacturer
Hewlett-Packard
Datasheet
Cascadable Silicon Bipolar
MMIC Amplifier
Technical Data
Features
• Cascadable 50
• 3 dB Bandwidth:
• 12.0 dB Typical Gain at
• Unconditionally Stable
Description
The MSA-0200 is a high perfor-
mance silicon bipolar Monolithic
Microwave Integrated Circuit
(MMIC) chip. This MMIC is
designed for use as a general
purpose 50
applications include narrow and
broad band IF and RF amplifiers
in commercial, industrial and
military applications.
Typical Biasing Configuration
5965-9695E
IN
DC to 2.8 GHz
1.0 GHz
(k>1)
C
block
gain block. Typical
MSA
Gain Block
V
d
= 5 V
RFC (Optional)
R
C
bias
block
The MSA-series is fabricated using
HP’s 10 GHz f
silicon bipolar MMIC process
which uses nitride self-alignment,
ion implantation, and gold metalli-
zation to achieve excellent
performance, uniformity and
reliability. The use of an external
bias resistor for temperature and
current stability also allows bias
flexibility.
The recommended assembly
procedure is gold-eutectic die
attach at 400 C and either wedge
or ball bonding using 0.7 mil gold
wire.
section, “Chip Use”.
V
OUT
CC
[1]
> 7 V
See APPLICATIONS
T
, 25 GHz f
6-266
MAX
,
MSA-0200
Chip Outline
Note:
1. This chip contains additional biasing
options. The performance specified
applies only to the bias option whose
bond pads are indicated on the chip
outline. Refer to the APPLICATIONS
section “Silicon MMIC Chip Use” for
additional information.
[1]

Related parts for MSA-0200

MSA-0200 Summary of contents

Page 1

... Bandwidth 2.8 GHz • 12.0 dB Typical Gain at 1.0 GHz • Unconditionally Stable (k>1) Description The MSA-0200 is a high perfor- mance silicon bipolar Monolithic Microwave Integrated Circuit (MMIC) chip. This MMIC is designed for use as a general purpose 50 gain block. Typical applications include narrow and ...

Page 2

... The small spot size of this technique results in a higher, though more accurate determination of than do alternate methods. See MEASURE- jc MENTS section “Thermal Resistance” for more information. MSA-0200 Electrical Specifications Symbol Parameters and Test Conditions 2 G Power Gain (| ...

Page 3

... MSA-0200 Typical Scattering Parameters S Freq. 11 GHz Mag Ang 0.1 .11 179 12.6 0.2 .11 174 12.6 0.4 .10 170 12.5 0.6 .09 166 12.5 0.8 .08 162 12.4 1.0 .06 161 12.3 1.5 .02 –170 12.0 2.0 .05 –105 11.5 2.5 .10 –103 10.8 3.0 .17 –124 3.5 .22 –137 4.0 .26 –144 5.0 .29 –165 6.0 .33 –162 Note: 1. S-parameters are de-embedded from 70 mil package measured data using the package model found in the DEVICE MODELS section. Typical Performance, T ...

Page 4

... MSA-0200 Chip Dimensions NOT APPLICABLE INPUT GROUND 394 m 15.5 mil Unless otherwise specified, tolerances are 0.5 mils. Chip thickness is 114 m /4.5 mil. Bond pads are 41 m /1.6 mil typical on each side. Note 1: Output contact is made by die attaching the backside of the die. 394 m 15.5 mil OPTIONAL ...

Related keywords