MP3V5050V Freescale Semiconductor, MP3V5050V Datasheet - Page 3

• Manufacturer Part Number: MP3V5050V
• Description: High Temperature Accuracy Integrated Silicon Pressure Sensor On-Chip Signal Conditioned
• Manufacturer: Freescale Semiconductor

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pressure input. Typical minimum and maximum output
curves are shown for operation over 0 to 85°C temperature
range. The output will saturate outside of the rated pressure
range.
from the environment, while allowing the pressure signal to
FRAME
LEAD
WIRE BOND
Figure 4
A fluorosilicone gel isolates the die surface and wire bonds
DIFFERENTIAL SENSING ELEMENT
FLUOROSILICONE
GEL DIE COAT
Figure 2. Cross-Sectional Diagram
shows the sensor output signal relative to
2
3
1
0
–50
Transfer Function:
V
V
PE = 1.25
TM = 1
Temperature = 0 to 85°C
out
(not to scale)
s
= 3.0 ± 0.30 Vdc
= V
S
P2
P1
x (0.018 x P + 0.94) ± (PE x TM x 0.018 x V
–40
MAX
DIE
TRANSFER FUNCTION MP3V5050VC6T1
Figure 4. Output versus Differential Pressure
DIE BOND
THERMOPLASTIC
STAINLESS
STEEL CAP
CASE
–30
Pressure (kPa)
s
)
MIN
be transmitted to the silicon diaphragm. The MP3V5050V
pressure sensor operating characteristics, internal reliability
and qualification tests are based on use of dry air as the
pressure media. Media other than dry air may have adverse
effects on sensor performance and long-term reliability.
Contact the factory for information regarding media
compatibility in your application.
–20
1.0 µF
Figure 3. Typical Application Circuit
(Output Source Current Operation)
TYPICAL
–10
0.01 µF
V
s
+3 V
GND
IPS
V
0
out
Offset
(Typ)
470 pF
MP3V5050V
OUTPUT
3