S1GB Diodes, Inc., S1GB Datasheet
S1GB
Manufacturer Part Number
S1GB
Description
1.0A Surface Mount Glass Passivated Rectifier
Manufacturer
Diodes, Inc.
Datasheet
1.S1GB.pdf
(2 pages)
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Quantity
Price
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Part Number:
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Manufacturer:
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Part Number:
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Manufacturer:
DIODES
Quantity:
3 000
Features
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Mechanical Data
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Maximum Ratings and Electrical Characteristics
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
DS16003 Rev. 8 - 2
Notes:
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Rectified Output Current
Non-Repetitive Peak Forward Surge Current
(JEDEC Method)
Forward Voltage
Peak Reverse Leakage Current
at Rated DC Blocking Voltage
Typical Total Capacitance
Typical Thermal Resistance, Junction to Terminal (Note 2)
Operating and Storage Temperature Range
8.3ms Single half sine-wave superimposed on rated load
Glass Passivated Die Construction
Low Forward Voltage Drop and High Current
Capability
Surge Overload Rating to 30A Peak
Ideally Suited for Automated Assembly
Case: Molded Plastic
Case Material - UL Flammability Rating
Classification 94V-0
Moisture sensitivity: Level 1 per J-STD-020A
Terminals: Solder Plated Terminal -
Solderable per MIL-STD-202, Method 208
Polarity: Cathode Band or Cathode Notch
SMA Weight: 0.064 grams (approx.)
SMB Weight: 0.093 grams (approx.)
Marking: Type Number, See Page 2
Ordering Information: See Page 2
1. Measured at 1.0MHz and applied reverse voltage of 4.0V DC.
2. Thermal Resistance Junction to Terminal, unit mounted on PC board with 5.0 mm
Characteristic
@ T
@ T
@ T
@ I
A
A
T
1.0A SURFACE MOUNT GLASS PASSIVATED RECTIFIER
= 100°C
F
= 25°C
= 125°C
(Note 1)
= 1.0A
Symbol
V
T
V
V
j,
R(RMS)
R
I
V
FSM
I
RWM
V
C
RRM
I
RM
T
FM
qJT
O
R
T
STG
1 of 2
A
J
AB, BB, DB, GB, JB, KB, MB Suffix Designates SMB Package
A/AB
S1
50
35
H
A, B, D, G, J, K, M Suffix Designates SMA Package
T
A
B/BB
B
E
= 25°C unless otherwise specified
100
S1
G
70
SPICE MODELS: S1A S1B S1D S1G S1J S1K S1M
D/DB
200
140
S1
2
S1A/B - S1M/B
C
(0.013 mm thick) copper pads as heat sink.
D
-65 to +150
G/GB
400
280
100
1.0
1.1
5.0
S1
30
10
30
Dim
G
A
B
C
D
E
H
J
J/JB
All Dimensions in mm
600
420
S1
2.29
4.00
1.27
0.15
4.80
0.10
0.76
2.01
Min
SMA
K/KB
800
560
Max
2.92
4.60
1.63
0.31
5.59
0.20
1.52
2.62
S1
S1A/B - S1M/B
M/MB
3.30
4.06
1.96
0.15
5.00
0.10
0.76
2.00
1000
Min
700
S1
SMB
Max
3.94
4.57
2.21
0.31
5.59
0.20
1.52
2.62
°C/W
Unit
mA
pF
°C
V
V
A
A
V
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S1GB Summary of contents
Page 1
Features · Glass Passivated Die Construction · Low Forward Voltage Drop and High Current Capability · Surge Overload Rating to 30A Peak · Ideally Suited for Automated Assembly Mechanical Data · Case: Molded Plastic · Case Material - UL Flammability ...
Page 2
... Ordering Information (Note 3) Device* S1x-7 S1xB-7 Notes: 3. For Packaging Details our website at http://www.diodes.com/datasheets/ap02007.pdf Device type, e.g. S1A-7 (SMA package); S1AB-7 (SMB package). Marking Information 1.0 0.8 0.6 0.4 0.2 Resistive or inductive load 100 120 T , TERMINAL TEMPERATURE (°C) T Fig. 1 Forward Current Derating Curve 30 25 ...