MCP1612 Microchip Technology, MCP1612 Datasheet - Page 5

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MCP1612

Manufacturer Part Number
MCP1612
Description
1.4 MHz Synchronous Buck Regulator
Manufacturer
Microchip Technology
Datasheet

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DC CHARACTERISTICS (CONTINUED)
TEMPERATURE SPECIFICATIONS
© 2005 Microchip Technology Inc.
Electrical Specifications: Unless otherwise noted, V
I
Protection Features
Undervoltage Lockout
Undervoltage Lockout Hysteresis
Thermal Shutdown
Thermal Shutdown Hysteresis
Interface Signal (SHDN)
Logic-High Input
Logic-Low Input
Note 1:
Electrical Specifications: V
Temperature Ranges
Storage Temperature Range
Maximum Junction Temperature
Operating Junction Temperature Range
Thermal Package Resistances
Thermal Resistance, 8L-MSOP
Thermal Resistance, 8L-DFN
LOAD
= 100 mA, T
2:
Parameters
The integrated MOSFET switches have an integral diode from the L
these diodes are forward-biased, the package power dissipation limits must be adhered to. Thermal protection is not
able to regulate the junction temperature for these cases.
UVLO is specified for a falling V
return to operation.
Parameters
A
= +25°C. Boldface specifications apply over the T
IN
= 3.0V to 5.5V, F
UVLO-
T
V
V
SHD-HYS
UVLO
IN-HIGH
T
IN-LOW
Sym
SHD
HYS
IN
. Once the UVLO is activated, the UVLO-
Sym
T
T
T
JA
JA
OSC
A
A
J
Min
2.4
45
= 1 MHz with 10% Duty Cycle, C
IN
= V
Min
- 40
-65
CC
= V
2.55
Typ
200
160
9
SHDN
Typ
208
41
A
= 3.3V, V
range of -40°C to +85°C.
Max
2.7
15
+ 125
+150
+150
Max
X
OUT
pin to V
% of V
% of V
Units
Units
= 1.8V, C
IN
°C/W
°C/W
mV
HYS
°C
°C
V
°C
°C
°C
= 0.1 µF. T
IN
IN
IN
must be overcome before the device will
and from L
Note 2
Note 1
Continuous
Transient Only
Continuous Operation
Typical 4-layer board interconnecting
vias
Typical 4-layer board interconnecting
vias
IN
= C
A
= -40°C to +125°C.
OUT
X
MCP1612
to P
= 10 µF, L = 3.3 µH,
Conditions
Conditions
GND
. In cases where
DS21921B-page 5

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