MCP1725 Microchip Technology, MCP1725 Datasheet - Page 24

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MCP1725

Manufacturer Part Number
MCP1725
Description
Low Quiescent Current LDO Regulator
Manufacturer
Microchip Technology
Datasheet

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MCP1725
8-Lead Plastic Dual Flat No Lead Package (MC) 2x3 Body (DFN) – Saw Singulated
DS22026A-page 24
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
A3
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. § Significant Characteristic
4. Package is saw singulated
5. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
N
1
TOP VIEW
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Length
Overall Width
Exposed Pad Length
Exposed Pad Width
Contact Width
Contact Length §
Contact-to-Exposed Pad §
2
D
A1
Dimension Limits
E
A
NOTE 2
EXPOSED PAD
Microchip Technology Drawing No. C04–123, Sept. 8, 2006
Units
A1
A3
D2
E2
N
A
D
E
K
e
b
L
L
K
MIN
0.80
0.00
1.30
1.50
0.18
0.30
0.20
MILLIMETERS
BOTTOM VIEW
b
0.50 BSC
0.20 REF
2.00 BSC
3.00 BSC
NOM
0.90
0.02
0.25
0.40
8
D2
2
e
© 2006 Microchip Technology Inc.
MAX
1.00
0.05
1.75
1.90
0.30
0.50
1
N
E2
NOTE 1

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