MCP23016 Microchip Technology, MCP23016 Datasheet - Page 29
![no-image](/images/manufacturer_photos/0/4/439/microchip_technology_sml.jpg)
MCP23016
Manufacturer Part Number
MCP23016
Description
16-Bit I2C I/O Expander
Manufacturer
Microchip Technology
Datasheet
1.MCP23016.pdf
(38 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MCP23016-I/SP
Manufacturer:
AirBORN
Quantity:
214
Company:
Part Number:
MCP23016-I/SS
Manufacturer:
MICROCHI
Quantity:
271
Company:
Part Number:
MCP23016-I/SS
Manufacturer:
Microchip
Quantity:
2 084
www.DataSheet4U.com
28-Lead Plastic Small Outline (SO) – Wide, 7.50 mm Body [SOIC]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
© 2007 Microchip Technology Inc.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
NOTE 1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A
A1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer (optional)
Foot Length
Footprint
Foot Angle Top
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
N
1 2 3
b
D
Dimension Limits
e
A2
Units
E1
A2
A1
E1
L1
N
A
E
D
α
e
h
L
φ
c
b
β
α
E
MIN
2.05
0.10
0.25
0.40
0.18
0.31
φ
0°
5°
5°
–
L1
L
MILLMETERS
10.30 BSC
17.90 BSC
1.27 BSC
7.50 BSC
1.40 REF
h
NOM
28
–
–
–
–
–
–
–
–
–
–
Microchip Technology Drawing C04-052B
h
MCP23016
MAX
2.65
0.30
0.75
1.27
0.33
0.51
15°
15°
8°
β
–
DS20090C-page 29
c