LM3352MTC-2.5 National Semiconductor, LM3352MTC-2.5 Datasheet - Page 9

• Manufacturer Part Number: LM3352MTC-2.5
• Description: Regulated 200 mA Buck-Boost Switched Capacitor DC/DC Converter
• Manufacturer: National Semiconductor

Ceramic
Tantalum
Polymer Electrolytic
Filter Capacitor Selection
iii) C
A 1 µF, XR7 ceramic capacitor should be connected to pin
C
ternal supply rail of the LM3352.
Maximum Available Output Current
The LM3352 cannot provide 200 mA under all V
conditions. The V
mance Characteristics section show the minimum V
which the LM3352 is capable of providing different load cur-
rents while maintaining V
cal Characteristics for guaranteed conditions.
Maximum Load Under Start-Up
Due to the LM3352’s unique start-up sequence, it is not able
to start up under all load conditions. Starting with 45 mA or
less will allow the part to start correctly under any tempera-
ture or input voltage conditions. After the output is in regula-
tion, any load up to the maximum as specified in the Electri-
cal Characteristics may be applied. Using a Power On Reset
Typical Application Circuits
FIL
. This capacitor provides the filtering needed for the in-
FIL
OUT
vs V
OUT
IN
Taiyo-yuden
AVX
Sprague/Vishay
Nichicon
Cornell-Dubilier (ESRD)
Sanyo (POSCAP)
regulation. Refer to the Electri-
graphs in the Typical Perfor-
Manufacturer
TABLE 2. Capacitor Vendor Information
FIGURE 2. Basic Buck/Boost Regulator
(Continued)
IN
and V
IN
OUT
at
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9
Tel
Of the different capacitor technologies, a sample of vendors
that have been verified as suitable for use with the LM3352
are shown in Table 2 .
circuit, such as the LP3470, is recommended if greater start
up loads are expected. Under certain conditions the LM3352
can start up with greater load currents without the use of a
Power On Reset Circuit ( See application note AN-1144:
Maximizing Startup Loads with the LM3352 Regulated
Buck/Boost Switched Capacitor Converter ).
Thermal Protection
During output short circuit conditions, the LM3352 will draw
high currents causing a rise in the junction temperature.
On-chip thermal protection circuitry disables the charge
pump action once the junction temperature exceeds the
thermal trip point, and re-enables the charge pump when the
junction temperature falls back to a safe operating point.
[phone]
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Fax
DS101037-33
www.t-yuden.com
www.avxcorp.com
www.vishay.com
www.nichicon.com
www.cornell-dubilier.com
www.sanyovideo.com
Website
www.national.com