LM32 National Semiconductor Corporation, LM32 Datasheet - Page 2

• Manufacturer Part Number: LM32
• Description: Dual Thermal Diode Temperature Sensor With SensorPath™ Bus
• Manufacturer: National Semiconductor Corporation

www.national.com
1, 6, 7,12, 13,
Connection Diagram
Pin Description
Pin Number
8, 10
9, 11
14
2
3
4
5
National Package Number MTC14C
V+/+3.3V_SBY
TSSOP-14
Pin Name
Top View
D1+, D2+
D1-, D2-
SWD
GND
ADD
NC
Description
No Connect
Ground
Positive power supply pin
SensorPath Bus line; Open-drain
output
Digital input - device number select
input for the serial bus device
number
Thermal diode analog voltage
output and negative monitoring
input
Thermal diode analog current
output and positive monitoring input
20071102
2
Order
Number
LM32CIMT
LM32CIMTX
Typical Connection
May be tied to V+, GND or left floating
System ground
Connected system 3.3 V standby power and
to a 0.1 µF bypass capacitor in parallel with
100 pF. A bulk capacitance of approximately
10 µF needs to be in the near vicinity of the
LM32.
Super I/O, Pull-up resistor, 1.6k
Pull-up to 3.3 V or pull-down to GND resistor,
10k; must never be left floating
Remote Thermal Diode cathode
(THERM_DC) - Diode 1 should always be
connected to the processor thermal diode.
Diode 2 may be connected to an MMBT3904
or GPU thermal diode. A 100 pF capacitor
should be connected between respective D-
and D+ for noise filtering.
Remote Thermal Diode anode (THERM_DA) -
Diode 1 should always be connected to the
processor thermal diode. Diode 2 may be
connected to an MMBT3904 or GPU thermal
diode. A 100 pF capacitor should be
connected between respective D- and D+ for
noise filtering.
Package
Marking
LM32
LM32
CIMT
CIMT
Package
MTC14C
MTC14C
Number
NS
Transport
Media
94 units per
rail
2500 units in
tape and reel