MAX17112 Maxim Integrated Products, MAX17112 Datasheet - Page 12

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MAX17112

Manufacturer Part Number
MAX17112
Description
DC-DC Converter
Manufacturer
Maxim Integrated Products
Datasheet

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High-Performance, Step-Up, DC-DC Converter
2) Create a power ground island (PGND) consisting of
3) Place the feedback-voltage-divider resistors as close
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
12 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
© 2008 Maxim Integrated Products
TRANSISTOR COUNT: 4624
PROCESS: BiCMOS
the input and output capacitor grounds and GND
pins. Connect all of these together with short, wide
traces or a small ground plane. Maximizing the
width of the power ground traces improves efficien-
cy and reduces output voltage ripple and noise
spikes. Create an analog ground plane (AGND)
consisting of the feedback-divider ground connec-
tion, the COMP and SS capacitor ground connec-
tions, and the device’s exposed backside pad.
Connect the AGND and PGND islands by connect-
ing the GND pins directly to the exposed backside
pad. Make no other connections between these
separate ground planes.
as possible to the feedback pin. The divider’s center
trace should be kept short. Placing the resistors far
away causes the FB trace to become an antenna
that can pick up switching noise. Care should be
taken to avoid running the feedback trace near LX or
the switching nodes in the charge pumps.
Chip Information
Maxim is a registered trademark of Maxim Integrated Products, Inc.
4) Place IN and V
5) Minimize the length and maximize the width of the
6) Minimize the size of the LX node while keeping it
Refer to the MAX17112 evaluation kit for an example of
proper board layout.
For the latest package outline information and land patterns, go
to www.maxim-ic.com/packages.
PACKAGE TYPE
possible to the device. The ground connections of
the IN and V
ed directly to the AGND with a wide trace.
traces between the output capacitors and the load
for best transient responses.
wide and short. Keep the LX node away from the
feedback node and analog ground. Use DC traces
as a shield if necessary.
10 TDFN-EP
L
bypass capacitor should be connect-
L
PACKAGE CODE
pin bypass capacitors as close as
Package Information
T1033+2
DOCUMENT NO.
21-0137

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