FT232R Future Technology Devices Intl Ltd., FT232R Datasheet - Page 14

• Manufacturer Part Number: FT232R
• Manufacturer: Future Technology Devices Intl Ltd.

The FT232R is supplied in Pb free 28 LD SSOP and QFN-32 packages. The recommended solder reflow profile for
both package options is shown in Figure 8.
Figure 8 - FT232R Solder Reflow Profile
The recommended values for the solder reflow profile are detailed in Table 4. Values are shown for both a completely
Pb free solder process (i.e. the FT232R is used with Pb free solder), and for a non-Pb free solder process (i.e. the
FT232R is used with non-Pb free solder).
Table 4 - Reflow Profile Parameter Values
FT232R USB UART I.C. Datasheet Version 1.02
Profile Feature
Average Ramp Up Rate (T
- Temperature Min (T
- Temperature Max (T
- Time (t
- Temperature (T
- Time (t
Peak Temperature (T
Time within 5°C of actual Peak Temperature (t
Ramp Down Rate
Time for T= 25°C to Peak Temperature, T
Time Maintained Above Critical Temperature T
S
L
5.3 Solder Reflow Profile
)
Min to t
L
S
)
Max)
25
S
P
S
Preheat
)
T
T
Min.)
p
Max.)
L
T Max
T Min
S
S
s
to T
p
)
p
P
T = 25º C to T
Preheat
)
Time, t (seconds)
L
t
S
:
P
Pb Free Solder Process
Ramp Up
3°C / second Max.
60 to 120 seconds
60 to 150 seconds
6°C / second Max.
20 to 40 seconds
8 minutes Max.
150°C
200°C
217°C
260°C
© Future Technology Devices International Ltd. 2005
t
p
t
L
Non-Pb Free Solder Process
Ramp
Down
Critical Zone: when
3°C / Second Max.
60 to 120 seconds
60 to 150 seconds
6°C / second Max.
20 to 40 seconds
T is in the range
6 minutes Max.
100°C
150°C
183°C
240°C
T to T
L
p