MAX4951 Maxim Integrated Products, MAX4951 Datasheet - Page 7

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MAX4951

Manufacturer Part Number
MAX4951
Description
SATA I/SATA II Bidirectional Re-Driver
Manufacturer
Maxim Integrated Products
Datasheet

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The exposed-pad, 20-pin, TQFN package incorporates
features that provide a very low thermal-resistance path
for heat removal from the IC. The exposed pad on the
MAX4951 must be soldered to GND for proper thermal
and electrical performance. For more information on
exposed-pad packages, refer to Maxim Application
Note HFAN-08.1: Thermal Considerations of QFN and
Other Exposed-Paddle Packages .
Use controlled-impedance transmission lines to inter-
face with the MAX4951 high-speed inputs and outputs.
Place power-supply decoupling capacitors as close as
possible to V
CC
.
_______________________________________________________________________________________
SATA I/SATA II Bidirectional Re-Driver
Exposed-Pad Package
X = Don’t Care
EN
0
1
1
1
1
BA
HAM
HBM
HAP
HBP
X
0
1
0
1
BB
X
0
0
1
1
50Ω
50Ω
Layout
GND
V
V
Standard SATA
Standard SATA
CC
CC
CHANNEL A
CONTROL LOGIC
Standby
BA
MAX4951
Boost
Boost
MAX4951
50Ω
50Ω
V
BB
CC
50Ω
50Ω
EN
Caution: Do not exceed the absolute maximum rat-
ings because stresses beyond the listed ratings
may cause permanent damage to the device.
Proper power-supply sequencing is recommended for
all devices. Always apply V
especially if the signal is not current limited.
V
V
CC
CC
Functional Diagram/Truth Table
50Ω
50Ω
Standard SATA
Standard SATA
CHANNEL B
Standby
Boost
Boost
DAP
DAM
DBM
DBP
Power-Supply Sequencing
CC
before applying signals,
7

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