ICP-S ROHM Electronics, ICP-S Datasheet - Page 11

• Manufacturer Part Number: ICP-S
• Description: Overcurrent Protection Elements
• Manufacturer: ROHM Electronics

Overcurrent Protection Elements
8. Application Circuit Example
8-1 Recommended Flow Soldering Conditions
8-2 Recommended Reflow Soldering Conditions
8-3 Recommended Copper Pattern on PCB
(°C)
(°C)
300
250
200
150
100
250
200
150
100
50
25
50
0
A peak temperature of at least 230°C is recommended. If the peak temperature is less than 230°C, it is recommended to
make some adjustments, such as the retention of the peak temperature and soldering time longer and an increase in the thickness
of solder paste.
∗ Number of reflow times: 2 TIMES Max.
1 to 5°C / sec
Preheating
2 minutes min.
5 minutes min.
speed
Preheating
120°C
100°C
Reflow heating temperature
120 to 160°C,
50 to 120 sec
Preheating
1 to 5°C / sec
10 seconds min.
Soldering
260°C
230°C
1.6 to 2.0
4.0 to 5.0
(High-temperature
Reflow soldering
1 minute min.
retention time)
Natural cooling
30 to 60 sec
Peak temperature
230 to 260°C, 10sec Max.
200°C,
60sec Min.
Cooling
ICP-S Technical Manual
Manual soldering conditions
Soldering iron temperature: 350°C max.
Soldering time: 3 seconds max.
Rev.A
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