MAX5732 Maxim, MAX5732 Datasheet - Page 25

• Manufacturer Part Number: MAX5732
• Description: 32-Channel / 16-Bit / Voltage-Output DACs with Serial Interface
• Manufacturer: Maxim

breakdown voltages. Some devices require external
protection on their reference inputs to satisfy absolute
maximum ratings. The MAX5734 features outputs that
are almost rail-to-rail. This allows the AV
supplies to be set to voltages within the absolute maxi-
mum ratings of the PEIC. This guarantees that the PEIC
is protected in all situations.
Additional protection is provided by the MAX5734
glitch-free power-up into the clear state with all DAC
outputs set to approximately 0V. Either the serial port or
the CLR input can assert the clear function.
Grounding and power-supply decoupling strongly influ-
ence device performance. Digital signals can couple
through the reference input, power supplies, and ground
connection. Proper grounding and layout can reduce
TRANSISTOR COUNT: 152,000
PROCESS: BiCMOS
TOP VIEW
AGND
AV
OUT9
OUT8
OUT7
OUT6
OUT5
OUT4
OUT3
OUT2
OUT1
OUT0
N.C.
V
CC
SS
10
11
12
13
14
1
2
3
4
5
6
7
8
9
56
15
55
16
17
54
8mm x 8mm THIN QFN-EP
53
18
______________________________________________________________________________________
Power Supplies, Bypassing,
52
19
EXPOSED PADDLE
20
51
MAX5732
MAX5733
MAX5734
MAX5735
Decoupling, and Layout
50
21
Pin Configuration
22
49
Chip Information
23
48
32-Channel, 16-Bit, Voltage-Output
24
47
25
46
26
45
27
44
28
CC
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
and V
AV
OUT21
OUT22
V
AGND
OUT23
OUT24
OUT25
OUT26
OUT27
OUT28
OUT29
OUT30
OUT31
SS
CC
DACs with Serial Interface
SS
digital feedthrough and crosstalk. Bypass all power sup-
plies with an additional 0.1µF and 1µF on each pin, as
close to the device as possible. Refer to the MAX5732–
MAX5735 evaluation kit for a suggested layout.
The MAX5732–MAX5735 have four separate power
supplies. AV
(except for the output buffers) and DV
digital section of the device. AV
output buffers.
The MAX5732–MAX5735 feature an exposed paddle on
the backside of the package for improved power dissi-
pation. The exposed paddle is electrically connected to
V
that shares the same potential. For more information on
the exposed paddle QFN package, refer to the following
website: http://pdfserv.maxim-ic.com/arpdf/AppNotes/
4hfan081.pdf
MAX5732ACTN
MAX5732BCTN
MAX5732CCTN
MAX5732AETN
MAX5732BETN
MAX5732CETN
MAX5733ACTN
MAX5733BCTN
MAX5733CCTN
MAX5733AETN
MAX5733BETN
MAX5733CETN
MAX5734ACTN
MAX5734BCTN
MAX5734CCTN
MAX5734AETN
MAX5734BETN
MAX5734CETN
MAX5735ACTN
MAX5735BCTN
MAX5735CCTN
MAX5735AETN
MAX5735BETN
MAX5735CETN
SS
, and should be soldered to a large copper plane
PART
DD
powers the internal analog circuitry
INL (MAX LSB)
±16
±64
±16
±64
±16
±64
±16
±64
±16
±64
±16
±64
±16
±64
±16
±64
±8
±8
±8
±8
±8
±8
±8
±8
Selector Guide
CC
OUTPUT VOLTAGE
and V
RANGE (V)
-2.5 to +7.5
-2.5 to +7.5
-2.5 to +7.5
-2.5 to +7.5
-2.5 to +7.5
-2.5 to +7.5
DD
-5 to +5
-5 to +5
-5 to +5
-5 to +5
-5 to +5
-5 to +5
0 to +5
0 to +5
0 to +5
0 to +5
0 to +5
0 to +5
0 to +10
0 to +10
0 to +10
0 to +10
0 to +10
0 to +10
SS
powers the
power the
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