MAX9776 Maxim Integrated Products, MAX9776 Datasheet - Page 15

• Manufacturer Part Number: MAX9776
• Description: (MAX9775 / MAX9776) Stereo Class D Audio Subsystem
• Manufacturer: Maxim Integrated Products

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TQFN
4, 29
EP
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
30
31
32
1
2
3
5
6
7
8
9
PIN
2 x 1.5W, Stereo Class D Audio Subsystem
D1, F3
UCSP
D2
C1
C2
B1
B2
A1
A2
B3
A3
A4
B4
A5
A6
B5
B6
C5
C6
D6
D5
F1
E1
E6
E5
F6
F5
E4
F4
E3
F2
E2
—
______________________________________________________________________________________
CPGND
OUTR+
OUTL+
CPV
OUTRx
OUTR-
NAME
OUTL-
CPV
with DirectDrive Headphone Amplifier
PGND
VBIAS
SHDN
CR_H
PV
CL_H
CR_L
CL_L
INC1
INC2
INB2
INB1
GND
INA2
INA1
SDA
C1N
HPR
SCL
C1P
HPL
V
V
EP
DD
SS
DD
DD
SS
Class D Power Supply
Negative Left-Speaker Output
Serial Clock Input. Connect a 1kΩ pullup resistor from SCL to V
Power Ground
Positive Left-Speaker Output
Serial Data Input. Connect a 1kΩ pullup resistor from SDA to V
3D External Capacitor 3. Connect a 22nF capacitor to GND.
3D External Capacitor 4. Connect a 22nF capacitor to GND.
Charge-Pump Power Supply
Charge-Pump Flying Capacitor Positive Terminal
Common-Mode Bias
Charge-Pump GND
Charge-Pump Flying Capacitor Negative Terminal
Input C1. Left input or positive input (see Table 5a).
Charge-Pump Output. Connect to V
Left Headphone Output
Headphone Amplifier Negative Power Supply. Connect to CPV
Right Headphone Output
Input C2. Right input or negative input (see Table 5a).
Mono Receiver Output
Analog Power Supply
Input B2. Right input or negative input (see Table 5a).
3D External Capacitor 1. Connect a 22nF capacitor to GND.
Input B1. Left input or positive input (see Table 5a).
Analog Ground
3D External Capacitor 2. Connect a 22nF capacitor to GND.
Input A2. Right input or negative input (see Table 5a).
Positive Right Speaker Output
Input A1. Left input or positive input (see Table 5a).
Negative Right Speaker Output
Active-Low Hardware Shutdown
Exposed Pad. The external pad lowers the package’s thermal impedance by providing a
direct heat conduction path from the die to the PCB. The exposed pad is internally connected
to GND. Connect the exposed thermal pad to the GND plane.
SS
.
FUNCTION
Pin Description—MAX9775
DD
SS
DD
.
.
.
15