TEA1623PH Philips Semiconductors, TEA1623PH Datasheet - Page 15

• Manufacturer Part Number: TEA1623PH
• Description: STARplug
• Manufacturer: Philips Semiconductors

Philips Semiconductors
15. Soldering
9397 750 12579
Product data sheet
15.1 Introduction to soldering through-hole mount packages
15.2 Soldering by dipping or by solder wave
15.3 Manual soldering
15.4 Package related soldering information
This text gives a brief insight to wave, dip and manual soldering. A more in-depth account
of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages
(document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of through-hole mount IC packages
on a printed-circuit board.
Driven by legislation and environmental forces the worldwide use of lead-free solder
pastes is increasing. Typical dwell time of the leads in the wave ranges from
3 to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb or
Pb-free respectively.
The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic
body must not exceed the specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling may be necessary immediately
after soldering to keep the temperature within the permissible limit.
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is
less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is
between 300 and 400 C, contact may be up to 5 seconds.
Table 7:
[1]
[2]
Package
DBS, DIP, HDIP, RDBS, SDIP, SIL
PMFP
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit
board.
For PMFP packages hot bar soldering or manual soldering is suitable.
[2]
Suitability of through-hole mount IC packages for dipping and wave soldering
methods
Rev. 01 — 17 March 2004
TEA1623P; TEA1623PH
Soldering method
Dipping
suitable
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Wave
suitable
not suitable
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[1]
STARplug
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