XP1001 Mimix Broadband, XP1001 Datasheet
XP1001
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XP1001 Summary of contents
Page 1
... Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com Characteristic Data and Specifications are subject to change without notice. ©2004 Mimix Broadband, Inc. Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept ...
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... Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept -10 0 -20 -5 -10 -30 -15 -40 -20 -50 -25 -60 -30 -70 -35 36.0 38.0 40.0 42.0 24.0 their obligation to be compliant with U.S. Export Laws. XP1001 Vd1,2,3,4=5.5 V Id1,2,3,4=430 mA 26.0 28.0 30.0 32.0 34.0 36.0 38.0 Frequency (GHz) S11 Avg S22 Avg P1001 0 -5 -10 -15 -20 -25 -30 -35 40.0 42.0 ...
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... P1001 1.910 6 (0.075 3.012 3.414 (0.119) (0.134) 3.213 3.540 (0.127) (0.139) Bond Pad #10 (Vd4) Bond Pad #11 (Vg4) Bond Pad #12 (Vd3) Bond Pad #13 (Vg3) Bypass Capacitors - See App Note [3] Vd1,2 Vg1,2 RF Out XP1001 Out Vd5 Vg3,4 Vd3,4 V1 Out Page ...
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... Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099 Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com Characteristic Data and Specifications are subject to change without notice. ©2004 Mimix Broadband, Inc. Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept ...
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... Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept Vd1 Vg1 Vg3 Vd3 XB1002 WG Sideband Reject their obligation to be compliant with U.S. Export Laws. P1001 Vd2 Vg2 Vg4 Vout2 Vd4 Vout1 Vd5 XP1001 RF Out 37.0-39.5 GHz On-Chip Temp Comp Detector Page Out ...
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... Devices need careful handling using correctly designed collets, vacuum pickups or, with care, sharp tweezers. Die Attachment - GaAs Products from Mimix Broadband are 0.100 mm (0.004") thick and have vias through to the backside to enable grounding to the circuit. Microstrip substrates should be brought as close to the die as possible ...