EK42650A-01 Peregrine Semiconductor Corp., EK42650A-01 Datasheet - Page 9

• Manufacturer Part Number: EK42650A-01
• Description: SP3T High Power Ultracmos RF Switch 30 MHz - 1000 MHz
• Manufacturer: Peregrine Semiconductor Corp.

PE42650A
Product Specification
Thermal Data
Though the insertion loss for this part is very low,
when handling high power RF signals, the part can
get quite hot.
Figure 24 shows the estimated power dissipation for
a given incident RF power level. Multiple curves are
presented to show the effect of poor VSWR
conditions. VSWR conditions that present short
circuit loads to the part can cause significantly more
power dissipation than with proper matching.
Figure 25 shows the estimated maximum junction
temperature of the part for similar conditions.
Note that both of these charts assume that the case
(GND slug) temperature is held at 85C. Special
consideration needs to be made in the design of the
PCB to properly dissipate the heat away from the
part and maintain the 85C maximum case
temperature. It is recommended to use best design
practices for high power QFN packages: multi-layer
PCBs with thermal vias in a thermal pad soldered to
the slug of the package. Special care also needs to
be made to alleviate solder voiding under the part.
Table 6. Theta JC
Document No. 70-0267-02 │ www.psemi.com
Theta JC (+85°C)
Parameter
Min
Typ
15
Max
Units
C/W
1 45
1 40
1 35
1 30
1 25
1 20
1 05
1 00
3.0
2.5
2.0
0.5
0.0
1 1 5
1 1 0
95
90
85
1 .5
1 .0
Figure 24. Power Dissipation
Figure 25. Maximum Junction Temperature
30
30
©2008-2009 Peregrine Semiconductor Corp. All rights reserved.
31 32
31 32
1:1 VSWR (50 Ohm Load)
2:1 VSWR (25 Ohm Load)
8:1 VSWR (6.25 Ohm Load)
20:1 VSWR (2.5 Ohm Load)
INF:1 VSWR (0 Ohm Load)
Reliabil ity Limit
1:1 VSWR (50 Ohm Load)
2:1 VSWR (25 Ohm Load)
8:1 VSWR (6.25 Ohm Load)
20:1 VSWR (2.5 Ohm Load)
INF:1 VSWR (0 Ohm Load)
Reliabil ity Limit
33
33
34 35
34 35
RF Power (dBm)
RF Power (dBm)
36
36
37
37
38
38
39
39
40
40
41 42 43
41 42 43
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