MPC8323E Freescale Semiconductor, MPC8323E Datasheet - Page 16

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MPC8323E

Manufacturer Part Number
MPC8323E
Description
Integrated Communications Processor Family Hardware Specifications
Manufacturer
Freescale Semiconductor
Datasheet

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DDR1 and DDR2 SDRAM
16
At recommended operating conditions with D n _GV
ADDR/CMD output setup with respect to MCK
ADDR/CMD output hold with respect to MCK
MCS output setup with respect to MCK
MCS output hold with respect to MCK
MCK to MDQS Skew
MDQ/MDM output setup with respect to MDQS
MDQ/MDM output hold with respect to MDQS
MDQS preamble start
MDQS epilogue end
Notes:
1. The symbols used for timing specifications follow the pattern of t
2. All MCK/MCK referenced measurements are made from the crossing of the two signals ±0.1 V.
3. ADDR/CMD includes all DDR SDRAM output signals except MCK/MCK, MCS, and MDQ/MDM/MDQS. For the ADDR/CMD
4. Note that t
5. Determined by maximum possible skew between a data strobe (MDQS) and any corresponding bit of data (MDQ), or data
6. All outputs are referenced to the rising edge of MCK(n) at the pins of the microprocessor. Note that t
inputs and t
(DD) from the rising or falling edge of the reference clock (KH or KL) until the output went invalid (AX or DX). For example,
t
(A) are setup (S) or output valid time. Also, t
(K) goes low (L) until data outputs (D) are invalid (X) or data output hold time.
setup and hold specifications, it is assumed that the Clock Control register is set to adjust the memory clocks by 1/2 applied
cycle.
from the rising edge of the MCK(n) clock (KH) until the MDQS signal is valid (MH). t
of the DQSS override bits in the TIMING_CFG_2 register. This will typically be set to the same delay as the clock adjust in
the CLK_CNTL register. The timing parameters listed in the table assume that these 2 parameters have been set to the same
adjustment value. See the MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Reference Manual for
a description and understanding of the timing modifications enabled by use of these bits.
mask (MDM). The data strobe should be centered inside of the data eye at the pins of the microprocessor.
symbol conventions described in note 1.
MPC8323E PowerQUICC™ II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 0
DDKHAS
symbolizes DDR timing (DD) for the time t
DDKHMH
(first two letters of functional block)(reference)(state)(signal)(state)
Table 19. DDR1 and DDR2 SDRAM Output AC Timing Specifications (continued)
Parameter
follows the symbol conventions described in note 1. For example, t
266 MHz
200 MHz
266 MHz
200 MHz
266 MHz
200 MHz
266 MHz
200 MHz
266 MHz
200 MHz
266 MHz
200 MHz
DD
DDKLDX
of (1.8 or 2.5 V) ± 5%.
MCK
Symbol
t
t
t
t
t
t
t
t
t
t
t
DDKHDS,
DDKHDX,
DDKHMH
DDKHMP
DDKHME
DDKHAS
DDKHAX
DDKHCS
DDKHCX
DDKLDS
DDKLDX
symbolizes DDR timing (DD) for the time t
memory clock reference (K) goes from the high (H) state until outputs
1
–0.5 × t
(first two letters of functional block)(signal)(state)(reference)(state)
for outputs. Output hold time can be read as DDR timing
1100
1200
–0.6
–0.6
Min
2.5
3.5
2.5
3.5
2.5
3.5
2.5
3.5
0.9
1.0
MCK
– 0.6
DDKHMH
–0.5 × t
DDKHMH
Max
0.6
0.6
MCK
can be modified through control
describes the DDR timing (DD)
MCK
+ 0.6
Freescale Semiconductor
memory clock reference
DDKHMP
Unit
ns
ns
ns
ns
ns
ns
ps
ns
ns
follows the
Notes
for
4
6
3
3
3
3
5
5
6

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