APL5606 Anpec Electronics Corporation, APL5606 Datasheet - Page 9

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APL5606

Manufacturer Part Number
APL5606
Description
Low Dropout 600ma Linear Regulator For Dc Fan Control
Manufacturer
Anpec Electronics Corporation
Datasheet
Application Information
Copyright
Rev. A.2 - Jan., 2008
Input Capacitor
The APL5606 requires proper input capacitors to supply
surge current during stepping load transients to prevent
the input rail from dropping. Because the parasitic induc-
tor from the voltage sources or other bulk capacitors to
the VIN limits the slew rate of the surge current, place the
Input capacitors near VIN as close as possible. The in-
put capacitors should be larger than 0.82 F.
Output Capacitor
The APL5606 needs a proper output capacitor to main-
tain circuit stability and to improve transient response
over temperature and current. In order to insure the cir-
cuit stability, the proper output capacitor value should be
larger than 1 F. With X5R and X7R dielectrics, 2.2 F is
sufficient at all operating temperatures.
Operation Region and Power dissipation
The APL5606 maximum power dissipation depends on
the thermal resistance and temperature difference be-
tween the die junction and ambient air. The power dissi-
pation P
where (T
junction and ambient air. θ
between Junction and ambient air. Assuming the T
and maximum T
the maximum power dissipation is calculated as:
For normal operation, do not exceed the maximum junc-
tion temperature of T
dissipation should less than:
APL5606
D
J
-T
across the device is:
P
P
P
A
) is the temperature difference between the
D
D
D(max)
ANPEC Electronics Corp.
=(125-25)/80
= 1.25 (W)
J
=150 C (typical thermal limit threshold),
T (
=(150-25)/80
= 1.56 (W)
J
JA
T
J
A
= 125 C. The calculated power
)
JA
is the thermal resistance
A
=25 C
9
V
Recommanded Minimum Footprint
Figure 1 illustrates the layout. Below is a checklist for
your layout:
1. Please place the input capacitors close to the VIN
2. Ceramic capacitors for load must be placed near the
3. To place APL5606 and output capacitors near the load
4. Large current paths, the bold lines in figure 1, must
PCB Layout Considerations
Optimum performance can only be achieved when the
device is mounted on a PC board according to the SOP-8
Board Layout diagram.
V
FSM
IN
load as close as possible
have wide tracks.
is good for performance.
C
IN
GND
V
IN
8
1
FSM
VIN
0.050
APL5606
SOP-8
C
7
2
IN
GND
Figure 1
Figure 2
Unit : Inch
GND
6
3
For dissipating heat
VOUT
VSET
V
OUT
0.024
5
4
C
OUT
www.anpec.com.tw
C
OUT
V
V
SET
OUT

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