APL5538 Anpec Electronics Corporation, APL5538 Datasheet - Page 15

• Manufacturer Part Number: APL5538
• Description: Dual Channel 300ma Regulator + Reset Ic
• Manufacturer: Anpec Electronics Corporation

Reflow Condition
APL5538
Physical Specifications
Copyright
Rev. A.6 - Jul., 2006
Classificatin Reflow Profiles
Average ramp-up rate
Preheat
Tsmax to T
Tsmax to T
Peak Temperature(Tp)
Time within 5 C of actual Peak
Temperature(tp)
Ramp-down Rate
Time 25 C to Peak Temperature
Note: All temperatures refer to topside of the package. Measured on the body surface.
Terminal Material
Lead Solderability
(T
- Ramp-up Rate
- Temperature Min (Tsmin)
- Temperature Mix (Tsmax)
- Time (min to max)(ts)
- Temperature(T
- Time (t
L
to T
Profile Feature
P
T
T
25
)
P
L
L
L
L
ANPEC Electronics Corp.
)
Tsmax
Tsmin
L
)
Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb), 100%Sn
Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.
(IR/Convection or VPR Reflow)
Preheat
10-30 seconds
225 +0/-5 C
t 25 C to Peak
Large Body
ts
Sn-Pb Eutectic Assembly
3 C/second max.
6 C/second max.
Ramp-up
60-120 seconds
60-150 seconds
6 minutes max.
100 C
150 C
183 C
15
10-30 seconds
240 +0/-5 C
Small Body
Tim e
tp
Ramp-down
t
L
10-30 seconds
245 +0/-5 C
Large Body
Pb-Free Assembly
3 C/second max.
6 C/second max.
3 C/second max
60-180 seconds
60-150 seconds
8 minutes max.
150 C
200 C
217 C
www.anpec.com.tw
Critical Zone
20-40 seconds
T
250 +0/-5 C
Small Body
L
to T
P