FMM5823X Eudyna Devices, Inc., FMM5823X Datasheet
FMM5823X
Related parts for FMM5823X
FMM5823X Summary of contents
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... Band: 17.7 - 27.0 GHz •High Linearity: OIP3 = 36.5dBm(typ.) •Impedance Matched Zin/Zout = 50Ω DESCRIPTION The FMM5823X is a power amplifier MMIC that contains a four stage amplifier, internally matched, for standard communications band in 17.7 to 27.0GHz frequency range. This product is well suited for point-to-point radio applications. ...
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... FMM5823X K-Band Power Amplifier MMIC Output Power vs. Frequency VDD=6V, IDD(DC)=700mA Frequency [GHz] Power Added Efficiency vs. Frequency VDD=6V, IDD(DC)=700mA Frequency [GHz] Output Power, Drain Current vs ...
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... FMM5823X IMD vs. Output Power VDD=6V, IDD(DC)=700mA IM3 2-tone Total Output Power [dBm] VDD=6V P1dB G1dB 600 700 800 900 1000 Drain Current [mA ...
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... FMM5823X K-Band Power Amplifier MMIC Output Power, Drain Current vs. Input Power by Drain Voltage IDD(DC)=700mA, f=17.7GHz Pout Drain Current - Input Pow er [dBm ] Output Power, Drain Current vs. Input Power by Drain Voltage ...
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... FMM5823X K-Band Power Amplifier MMIC Output Power, Drain Current vs. Input Power by Drain Current VDD=6V, f=21.2GHz 500m A 700m A 900m A Pout Drain Current - Input Pow er [dBm ] Output Power, Drain Current vs ...
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... FMM5823X K-Band Power Amplifier MMIC IMD vs. Output Power by Drain Voltage IDD(DC)=700mA, f=17.7GHz - -25 -30 -35 -40 -45 IM3 -50 -55 - 2-tone Total Pout [dBm] IMD vs. Output Power by Drain Voltage IDD(DC)=700mA, f=25GHz - -25 -30 ...
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... FMM5823X IMD vs. Output Power by Drain Current VDD=6V, f=21.2GHz IM3 2-tone Total Pout [dBm] IMD vs. Output Power by Drain Current VDD=6V, f=27GHz IM3 2-tone Total Pout [dBm] ...
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... FMM5823X K-Band Power Amplifier MMIC ■ ■ ■ ■ TUNING PERFORMANCE FMM5823X can be improved lower band performance by wire-bonding on MMIC chip. Output Power vs. Frequency VDD=6V, IDD(DC)=700mA, with-Tuning 33 Pin=12dBm 31 P1dB 29 27 Pin=8dBm 25 23 Pin=4dBm 21 Pin=0dBm Frequency [GHz] IMD vs ...
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... S11 -10 -15 - @VDD=6V, IDD=700mA S21 S22 Freqency [GHz] @VDD=6V, IDD=700mA S21 S22 Freqency [GHz] 9 FMM5823X K-Band Power Amplifier MMIC ...
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... FMM5823X K-Band Power Amplifier MMIC ■ ■ ■ ■ S-PARAMETER S11 S21 Frequency [GHz] Mag Ang Mag Ang 1.0 0.99 -14.89 0.01 120.39 0.0001 2.0 0.99 -28.80 0.01 -35.01 0.0001 3.0 0.99 -42.81 0.01 -136.89 0.0001 -116.82 4.0 0.99 -56.16 0.03 119.67 0.0001 5.0 0.98 -69.22 0.05 22.00 0.0002 6.0 0.98 -81.91 0.05 -65.62 0.0001 7.0 0.96 -93.46 0.03 -148.65 0.0000 8.0 0.95 -104.22 0.01 141.72 0.0002 -135.47 9.0 0.94 -114.42 0.00 105.72 0.0003 -146.04 10.0 0.93 -124.79 0.00 151.63 0.0004 -146.06 11 ...
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... Tch vs. Drain Voltage 1.E+12 1.E+11 1.E+10 1.E+09 1.E+08 1.E+07 1.E+06 1.E+05 1.E+04 1.E+03 1.E+02 1.E+01 50 100 K-Band Power Amplifier MMIC (Reference) IDD(DC)=700mA VDD [V] MTTF vs. Tch Ea=1.56eV 150 200 o Tch [ FMM5823X 9 250 ...
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... FMM5823X K-Band Power Amplifier MMIC ■ ■ ■ ■ Chip Outline and Bonding Pad Locations (Dimension in Micro-Meters) 0 1250 1145 RF-IN 445 105 0 0 105 685 VGG Ｎｏｔｅ : Drain voltage is required from either or both bonding pad( VDD4 or/and VDD5). Ｎｏｔｅ ...
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... Assembly Diagrams Recommended assembly “Copper” is the recommended material for the package or carrier. 220pF 220pF 220pF 220pF 0.15uF 0.15uF VGG 13 FMM5823X K-Band Power Amplifier MMIC VDD 0.15uF 220pF 220pF VDD ...
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... Bonding Conditions Method : Thermal Compression Bonding with Ultrasonic Power Tool Force : 0.196 N ± 0.0196 N Stage Temperature : 215 deg.C ± 5 deg.C Tool Heater : None Ultrasonic Power Transmitter : West Bond Model 1400 Duration : 150 mS/Bond FMM5823X Area of Chip Back Surface (mm^2) ...
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... This product must be discarded in accordance with methods specified by applicable hazardous waste procedures. Eudyna Devices Inc. reserves the right to change products and specifications without notice.The information does not convey any license under rights of Eudyna Devices Inc. or others. © 2006 Eudyna Devices Inc. 15 FMM5823X ...