MC74ACT541DWG ON Semiconductor, MC74ACT541DWG Datasheet - Page 10
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MC74ACT541DWG
Manufacturer Part Number
MC74ACT541DWG
Description
IC BUFF/DVR TRI-ST 8BIT 20SOIC
Manufacturer
ON Semiconductor
Series
74ACTr
Specifications of MC74ACT541DWG
Logic Type
Buffer/Line Driver, Non-Inverting
Number Of Elements
1
Number Of Bits Per Element
8
Current - Output High, Low
24mA, 24mA
Voltage - Supply
4.5 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
20-SOIC (7.5mm Width)
Logic Family
74ACT
Number Of Channels Per Chip
Octal
Polarity
Non-Inverting
Supply Voltage (max)
5.5 V
Supply Voltage (min)
4.5 V
Maximum Operating Temperature
85 C
Mounting Style
SMD/SMT
High Level Output Current
- 24 mA
Input Bias Current (max)
8 uA
Low Level Output Current
24 mA
Maximum Power Dissipation
500 mW
Minimum Operating Temperature
- 40 C
Number Of Lines (input / Output)
3
Output Type
3-State
Propagation Delay Time
7.5 ns @ 5 V
Current, Supply
80 μA
Function Type
8-Channels
Logic Function
Buffer/Driver
Number Of Circuits
Octal
Package Type
SOIC-20
Special Features
Tri-State
Temperature, Operating, Range
-40 to +85 °C
Voltage, Supply
5 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
MC74ACT541DWG
MC74ACT541DWGOS
MC74ACT541DWGOS
SEATING
PLANE
−T−
20
1
20
1
G
18X
20X
E
e
B
0.25
MC74AC540, MC74ACT540, MC74AC541, MC74ACT541
D
−A−
F
M
T
A
S
D
B
10
20 PL
11
10
11
S
0.25 (0.010)
A1
B
E
N
A
A
B
T
PACKAGE DIMENSIONS
SEATING
PLANE
PLASTIC DIP PACKAGE
K
M
http://onsemi.com
C
T
CASE 738−03
CASE 751D−05
A
N SUFFIX
DW SUFFIX
PDIP−20
ISSUE E
SOIC−20W
M
ISSUE G
10
C
J
L
20 PL
0.25 (0.010)
q
M
M
T
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
B
PER ASME Y14.5M, 1994.
PROTRUSION.
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF B
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
M
DIM
A1
A
B
C
D
E
H
h
L
q
e
NOTES:
12.65
10.05
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
4. DIMENSION B DOES NOT INCLUDE MOLD
MILLIMETERS
MIN
2.35
0.10
0.35
0.23
7.40
0.25
0.50
1.27 BSC
0
Y14.5M, 1982.
FORMED PARALLEL.
FLASH.
DIM
_
G
M
A
B
C
D
E
F
J
K
L
N
12.95
10.55
MAX
2.65
0.25
0.49
0.32
7.60
0.75
0.90
1.010
0.240
0.150
0.015
0.050
0.008
0.020
0.110
MIN
7
0.050 BSC
0.100 BSC
0.300 BSC
0
_
INCHES
_
1.070
0.260
0.180
0.022
0.070
0.015
0.140
0.040
MAX
15
_
25.66
MILLIMETERS
MIN
6.10
3.81
0.39
1.27
0.21
2.80
0.51
1.27 BSC
2.54 BSC
7.62 BSC
0
_
27.17
MAX
6.60
4.57
0.55
1.77
0.38
3.55
1.01
15
_