MC10E116 ON Semiconductor, MC10E116 Datasheet - Page 6

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MC10E116

Manufacturer Part Number
MC10E116
Description
QUINT DIFFERENTIAL LINE RECEIVER
Manufacturer
ON Semiconductor
Datasheet

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NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
13. 10 Series: V
14. Within-device skew is defined as identical transitions on similar paths through a device.
15. Duty cycle skew is defined only for differential operation when the delays are measured from the cross point of the inputs to the cross point
Table 7. AC CHARACTERISTICS
Symbol
f
t
t
t
t
t
V
t
MAX
PLH
PHL
skew
skew
JITTER
r
/t
PP
100 Series: V
of the outputs.
f
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
Maximum Toggle Frequency
Propagation Delay to Output
Within-Device Skew (Note 14)
Duty Cycle Skew (Note 15)
Random Clock Jitter (RMS)
Input Voltage Swing
(Differential Configuration)
Rise/Fall Time 20−80%
EE
EE
can vary −0.46 V / +0.06 V.
can vary −0.46 V / +0.8 V.
D (Differential Configuration)
Characteristic
(See Application Note AND8020/D − Termination of ECL Logic Devices.)
Figure 3. Typical Termination for Output Driver and Device Evaluation
Driver
Device
D (Single−Ended)
V
Q
Q
CCx
t
PLH
= 5.0 V; V
− t
PHL
EE
Min
150
150
150
250
Z
Z
http://onsemi.com
= 0.0 V or V
o
o
= 50 W
= 50 W
−40°C
Typ
800
300
300
±10
375
< 1
50
50 W
V
6
TT
CCx
= V
Max
500
550
625
= 0.0 V; V
V
CC
TT
− 2.0 V
50 W
Min
200
150
150
275
EE
= −5.0 V (Note 13)
25°C
Typ
800
300
300
±10
375
< 1
50
D
D
Max
450
500
575
Receiver
Device
Min
200
150
150
275
85°C
Typ
800
300
300
±10
375
< 1
50
Max
450
500
575
MHz
Unit
mV
ps
ps
ps
ps
ps

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