MC10H188 ON Semiconductor, MC10H188 Datasheet - Page 4

• Manufacturer Part Number: MC10H188
• Description: Hex Buffer with Enable
• Manufacturer: ON Semiconductor

C
−L−
0.010 (0.250)
20
Z
G1
S
G
T
1
−N−
L−M
S
A
R
V
N
VIEW S
S
−M−
E
Y BRK
J
0.007 (0.180)
0.007 (0.180)
NOTES:
1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M,
2. DIMENSIONS IN INCHES.
3. DATUMS −L−, −M−, AND −N− DETERMINED WHERE TOP
4. DIMENSION G1, TRUE POSITION TO BE MEASURED AT
5. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH.
6. DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER
7. DIMENSION H DOES NOT INCLUDE DAMBAR
−T−
W
1982.
OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD
PARTING LINE.
DATUM −T−, SEATING PLANE.
ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.
THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE
BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY
MISMATCH BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION
TO BE GREATER THAN 0.037 (0.940). THE DAMBAR
INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO
BE SMALLER THAN 0.025 (0.635).
0.004 (0.100)
SEATING
PLANE
M
M
PACKAGE DIMENSIONS
D
D
T
T
L−M
L−M
http://onsemi.com
20 LEAD PLLC
CASE 775−02
S
S
ISSUE E
N
N
B
Z
S
S
4
VIEW D−D
U
0.007 (0.180)
K1
X
0.007 (0.180)
K
M
T
VIEW S
L−M
M
G1
T
S
L−M
DIM
F
G1
K1
W
A
B
C
E
G
H
K
R
U
V
X
Y
F
J
Z
H
N
S
0.010 (0.250)
S
0.385
0.385
0.165
0.090
0.013
0.026
0.020
0.025
0.350
0.350
0.042
0.042
0.042
0.310
0.040
MIN
−−−
0.050 BSC
0.007 (0.180)
2
N
INCHES
0.007 (0.180)
_
S
0.395
0.395
0.180
0.110
0.019
0.032
0.356
0.356
0.048
0.048
0.056
0.020
0.330
MAX
−−−
−−−
10
−−−
_
S
M
MILLIMETERS
T
MIN
9.78
9.78
4.20
2.29
0.33
0.66
0.51
0.64
8.89
8.89
1.07
1.07
1.07
7.88
1.02
M
−−−
1.27 BSC
2
L−M
T
_
T
L−M
10.03
10.03
L−M
MAX
4.57
2.79
0.48
0.81
9.04
9.04
1.21
1.21
1.42
0.50
8.38
S
−−−
−−−
10
−−−
_
S
N
S
S
N
N
S
S