MC14060BDG ON Semiconductor, MC14060BDG Datasheet - Page 7

• Manufacturer Part Number: MC14060BDG
• Description: IC COUNTER/OSC 14BIT BIN 16-SOIC
• Manufacturer: ON Semiconductor
• Series: 4000Br
• Type: Binaryr

Specifications of MC14060BDG

• Logic Type: Binary Counter
• Direction: Up
• Number Of Elements: 1
• Number Of Bits Per Element: 14
• Count Rate: 17MHz
• Trigger Type: Negative Edge
• Voltage - Supply: 3 V ~ 18 V
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (3.9mm Width)
• Counter Type: Binary
• Counting Sequence: Up
• Number Of Circuits: 1
• Logic Family: 14060
• Propagation Delay Time: 740 ns, 300 ns, 200 ns
• Supply Voltage (max): 18 V
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 55 C
• Function: Counter/Divider
• Mounting Style: SMD/SMT
• Operating Supply Voltage: 3 V to 18 V
• Circuit Type: Low-Power Schottky
• Current, Supply: 600 μA
• Function Type: 14-Bits
• Logic Function: Counter/Oscillator
• Package Type: SOIC-16
• Special Features: Binary
• Temperature, Operating, Range: -55 to +125 °C
• Voltage, Supply: 3 to 18 VDC
• Technology: CMOS
• Number Of Elements: 1
• Number Of Bits: 14
• Logical Function: Counter/Divider
• Operating Supply Voltage (typ): 3.3/5/9/12/15V
• Operating Temp Range: -55C to 125C
• Operating Supply Voltage (min): 3V
• Operating Supply Voltage (max): 18V
• Operating Temperature Classification: Military
• Mounting: Surface Mount
• Pin Count: 16
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Reset: -
• Timing: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: MC14060BDG; MC14060BDGOS

−T−
16
SEATING
1
PLANE
H
16
1
−A−
G
G
D
0.25 (0.010)
−A−
16 PL
F
D
9
8
16 PL
0.25 (0.010)
M
B
S
T
9
8
K
B
K
C
M
−B−
S
−T−
T
A
A
C
S
P
SEATING
PLANE
PACKAGE DIMENSIONS
M
PLASTIC SOIC PACKAGE
8 PL
http://onsemi.com
0.25 (0.010)
CASE 751B−05
J
CASE 648−08
MC14060B
M
P SUFFIX
D SUFFIX
SOIC−16
PDIP−16
ISSUE T
ISSUE J
7
M
L
R
B
X 45
S
_
M
J
F
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS
4. DIMENSION B DOES NOT INCLUDE
5. ROUNDED CORNERS OPTIONAL.
ANSI Y14.5M, 1982.
WHEN FORMED PARALLEL.
MOLD FLASH.
DIM
M
A
B
C
D
G
H
K
S
F
J
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
5. DIMENSION D DOES NOT INCLUDE DAMBAR
0.740
0.250
0.145
0.015
0.040
0.008
0.110
0.295
0.020
MIN
0.100 BSC
0.050 BSC
Y14.5M, 1982.
MOLD PROTRUSION.
PER SIDE.
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
DIM
0
M
A
B
C
D
F
G
K
P
R
INCHES
J
_
0.770
0.270
0.175
0.021
0.015
0.130
0.305
0.040
MILLIMETERS
MIN
MAX
9.80
3.80
1.35
0.35
0.40
0.19
0.10
5.80
0.25
0.70
10
1.27 BSC
0
_
_
10.00
MAX
18.80
MILLIMETERS
4.00
1.75
0.49
1.25
0.25
0.25
6.20
0.50
MIN
6.35
3.69
0.39
1.02
0.21
2.80
7.50
0.51
7
2.54 BSC
1.27 BSC
_
0
_
0.386
0.150
0.054
0.014
0.016
0.008
0.004
0.229
0.010
MIN
19.55
MAX
0.050 BSC
0
6.85
4.44
0.53
1.77
0.38
3.30
7.74
1.01
INCHES
10
_
_
MAX
0.393
0.157
0.068
0.019
0.049
0.009
0.009
0.244
0.019
7
_