S16MD02 Sharp Electrionic Components, S16MD02 Datasheet - Page 4

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S16MD02

Manufacturer Part Number
S16MD02
Description
8-Pin DIP Type SSR for Low Power Control
Manufacturer
Sharp Electrionic Components
Datasheet

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Notes 1 ) If large amount of surge is loaded onto V
1 ) All pins must be soldered since they are also used as heat sinks ( heat radiation fins ) . In
2 ) For higher radiation efficiency that allows wider thermal margin, secure a wider round
3 ) As for other general cautions, refer to the chapter“Precautions for Use”
Fig.11 Turn-on Time vs. Forward Current
Basic Operation Circuit
Precautions for Use
designing, consider the heat radiation from the mounted SSR.
pattern for Pin No.8 when designing mounting pattern. The rounded part of Pin No.5 ( gate )
must be as small as possible. Pulling the gate pattern around increases the change of being
affected by external noise.
( for resistance load )
2 ) Be sure to install a surge absorption circuit.
3 ) For phase control, adjust such that the load current immediately after the input signal is applied will be
AC supply voltage
20
10
5
4
3
2
10
more than 30mA.
An appropriate circuit must be chosen according to the load ( for CR, choose its constant ) . This must be
carefully done especially for an inductive load.
and 3 to prevent reverse bias from being applied to the infrared LED.
+ V
Load current
V
Input signal
I
CC
Tr1
Forward current I
R
20
1
( 1 ) DC Drive
D
1
( S16MD02/S26MD02 )
30
2
3
40 50
F
SSR
( mA )
V
R
T
8
6
D
L
a
= 25˚C
= 100
= 6V
Z
S
: Surge absorption circuit
100
Z
CC
S
or the driver circuit, add a diode D
AC 100V ( S16MD01/S16MD02 )
AC 200V ( S26MD01/S26MD02 )
( 2 ) Pulse Drive
Load
Fig.12 Zero-cross Voltage vs.
S16MD01/S16MD02/S26MD01/S26MD02
25
20
15
- 30
Ambient Temperature
Load : R
I
F
= 15mA
1
Ambient temperature T
between terminal 2
0
( 3 ) Phase Control
20
( S16MD02/S26MD02 )
40
60
a
( ˚C )
80
100

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