ST7577 Sitronix Technology, ST7577 Datasheet - Page 2
ST7577
Manufacturer Part Number
ST7577
Description
Dot Matrix LCD Controller/Driver
Manufacturer
Sitronix Technology
Datasheet
1.ST7577.pdf
(48 pages)
- Current page: 2 of 48
- Download datasheet (2Mb)
ST7577
3. ST7577 Pad Arrangement (COG)
Chip Size:
Chip Thickness: 480μm
Bump Height:
PAD Pitch:
Rough layout
l
l
Ver 1.0a
12~39
39~40
11~12
6~11
PAD
1~5
5~6
For easy LCM design, the Power-1, Power-2 & Power-3 are identical (any one of them can be used).
Power-3 has VGI, VGS, V0O, V0I, V0S, XV0O, XV0I and XV0S which are not in Power-1 or Power-2.
I/O Port-A and I/O Port-B are identical (except “RESB” pin). “MODE” pin is used to select Port-A or Port-B. Please
note the unused pins should be left floating.
Pitch
6074μm(X) x 720μm(Y)
15μm
84.5
84.5
60
60
60
89
40~49
49~50
50~72
72~73
73~96
96~97
PAD
Pitch
60
70
60
70
60
83
101~102
102~120
120~121
121~252
252~253
97~101
2/48
PAD
Pitch
130
69
34
57
34
57
253~272
272~273
273~277
277-1
PAD
Pitch
130
34
69
83
www.DataSheet4U.com
2008/02/14
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