DF18 Hirose Electric, DF18 Datasheet - Page 8

• Manufacturer Part Number: DF18
• Description: 0.4mm Contact Pitch, 1.5mm Above The Board, Board-to-board / Board-to-fpc Connectors
• Manufacturer: Hirose Electric

A252
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
DF18 Series●0.4mm Contact Pitch, 1.5mm above the board, Board-to-Board / Board-to-FPC Connectors
B
1.Recommended Temperature Profile (SMT)
2. Recommended soldering conditions
3. Recommended screen thickness and
4. Board warping
5. Cleaning conditions
6. Precautions
open area ratio (Pattern area ratio)
Usage Recommendations
Note1: UP to 2 cycles of Reflow soldering are possible under the same conditions, provided that
Note2: The temperature profile indicates the board surface temperature at the point of contacts
Soldering temperature: 350ç, soldering time: within 3 sec.
Thickness: 0.12 mm
Maximum of 0.02mm at the connector center section, with both ends of the connector as reference points.
Refer to "Nylon Connector Use Handbook".
■ Excessive twisting when mating/un-mating may cause damage to the connectors.
■ Specify receptacles with the metal hold-down when connecting rigid (non- flexible) printed
circuit boards.
there is a return to normal temperature between the first and second cycle
with the connector terminals.
Room temperature
Temperature (ç)
250
200
150
100
50
0
150ç
50
90~120sec
100
Preheating
180ç
150
250ç
220ç
200
60sec max
Soldering
250
Time (sec.)
300