IRL3705N International Rectifier, IRL3705N Datasheet

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IRL3705N

Manufacturer Part Number
IRL3705N
Description
HEXFET Power MOSFET
Manufacturer
International Rectifier
Datasheet

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Description
Fifth Generation HEXFETs from International Rectifier
utilize advanced processing techniques to achieve
extremely low on-resistance per silicon area. This
benefit, combined with the fast switching speed and
ruggedized device design that HEXFET Power
MOSFETs are well known for, provides the designer
with an extremely efficient and reliable device for use
in a wide variety of applications.
The TO-220 package is universally preferred for all
commercial-industrial applications at power dissipation
levels to approximately 50 watts. The low thermal
resistance and low package cost of the TO-220
contribute to its wide acceptance throughout the
industry.
Absolute Maximum Ratings
Thermal Resistance
I
I
I
P
V
E
I
E
dv/dt
T
T
R
R
R
AR
D
D
DM
AS
AR
J
STG
D
GS
@ T
@ T
JC
CS
JA
Logic-Level Gate Drive
Advanced Process Technology
Dynamic dv/dt Rating
175°C Operating Temperature
Fast Switching
Fully Avalanche Rated
@T
C
C
C
= 25°C
= 100°C
= 25°C
Continuous Drain Current, V
Continuous Drain Current, V
Pulsed Drain Current
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
Mounting torque, 6-32 or M3 srew
Junction-to-Case
Case-to-Sink, Flat, Greased Surface
Junction-to-Ambient
Parameter
Parameter
GS
GS
@ 10V
@ 10V
G
Typ.
300 (1.6mm from case )
0.50
–––
–––
HEXFET
10 lbf•in (1.1N•m)
-55 to + 175
D
S
Max.
89
310
170
± 16
340
TO-220AB
1.1
5.0
63
46
17
IRL3705N
®
R
Power MOSFET
DS(on)
Max.
V
0.90
–––
62
I
DSS
D
= 89A
PD - 9.1370C
= 55V
= 0.01
Units
Units
°C/W
W/°C
V/ns
mJ
mJ
°C
W
A
V
A
8/25/97

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IRL3705N Summary of contents

Page 1

... Soldering Temperature, for 10 seconds Mounting torque, 6- srew Thermal Resistance R Junction-to-Case JC R Case-to-Sink, Flat, Greased Surface CS R Junction-to-Ambient JA G Parameter @ 10V GS @ 10V GS Parameter PD - 9.1370C IRL3705N ® HEXFET Power MOSFET 55V DSS R = 0.01 DS(on 89A D S TO-220AB Max 310 170 1 ...

Page 2

... IRL3705N Electrical Characteristics @ T Parameter V Drain-to-Source Breakdown Voltage (BR)DSS Breakdown Voltage Temp. Coefficient (BR)DSS J R Static Drain-to-Source On-Resistance DS(on) V Gate Threshold Voltage GS(th) g Forward Transconductance fs I Drain-to-Source Leakage Current DSS Gate-to-Source Forward Leakage I GSS Gate-to-Source Reverse Leakage Q Total Gate Charge ...

Page 3

... Ga te-to-S o urce V oltage ( Fig 3. Typical Transfer Characteristics 1000 100 20 µ LSE 5° 100 IRL3705N VGS TOP 15V 12V 10V 8.0V 6.0V 4.0V 3.0V BOTT OM 2.5V 2 µ LSE 75°C 1 0.1 1 ...

Page 4

... IRL3705N 6000 iss 5000 4000 3000 2000 1000 rain-to-S ource Voltage ( Fig 5. Typical Capacitance Vs. Drain-to-Source Voltage 75° 5°C ...

Page 5

... Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case Fig 10a. Switching Time Test Circuit V 90% 125 150 175 ° 10% V Fig 10b. Switching Time Waveforms 0.001 t , Rectangular Pulse Duration (sec) 1 IRL3705N D.U. 5.0V Pulse Width µs Duty Factor ...

Page 6

... IRL3705N 10V Fig 12a. Unclamped Inductive Test Circuit Fig 12b. Unclamped Inductive Waveforms Charge Fig 13a. Basic Gate Charge Waveform 800 15 V 600 400 + ...

Page 7

... Fig 14. For N-Channel HEXFETS Circuit Layout Considerations Low Stray Inductance Ground Plane Low Leakage Inductance Current Transformer - + dv/dt controlled Driver same type as D.U.T. I controlled by Duty Factor "D" SD D.U.T. - Device Under Test P. Period Current di/dt Diode Recovery dv/dt Forward Drop 5% IRL3705N + =10V ...

Page 8

... IRL3705N Package Outline TO-220AB Outline Dimensions are shown in millimeters (inches (. (. & ...

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