IRLZ34N International Rectifier, IRLZ34N Datasheet

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IRLZ34N

Manufacturer Part Number
IRLZ34N
Description
55V Single N-channel HexFET Power MOSFET in a TO-220AB Package
Manufacturer
International Rectifier
Datasheet

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Description
Absolute Maximum Ratings
Thermal Resistance
Fifth Generation HEXFETs from International Rectifier
utilize advanced processing techniques to achieve the
lowest possible on-resistance per silicon area. This benefit,
combined with the fast switching speed and ruggedized
device design that HEXFET Power MOSFETs are well
known for, provides the designer with an extremely efficient
device for use in a wide variety of applications.
The TO-220 package is universally preferred for all
commercial-industrial applications at power dissipation
levels to approximately 50 watts. The low thermal resistance
and low package cost of the TO-220 contribute to its wide
acceptance throughout the industry.
T
I
I
I
P
V
E
I
E
dv/dt
T
R
R
R
D
D
DM
AR
AS
J
STG
AR
D
GS
@ T
@ T
CS
JA
JC
@T
Logic-Level Gate Drive
Advanced Process Technology
Dynamic dv/dt Rating
175°C Operating Temperature
Fast Switching
Fully Avalanche Rated
C
C
C
= 25°C
= 100°C
= 25°C
Continuous Drain Current, V
Continuous Drain Current, V
Power Dissipation
Pulsed Drain Current
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
Mounting torque, 6-32 or M3 screw.
Junction-to-Case
Case-to-Sink, Flat, Greased Surface
Junction-to-Ambient
Parameter
Parameter
GS
GS
@ 10V
@ 10V
G
Min.
––––
––––
––––
300 (1.6mm from case)
10 lbf•in (1.1N•m)
HEXFET
-55 to + 175
D
S
Typ.
––––
––––
0.50
Max.
0.45
110
±16
110
TO-220AB
6.8
5.0
30
21
68
16
®
R
IRLZ34N
Power MOSFET
DS(on)
Max.
––––
V
2.2
62
DSS
I
D
PD - 9.1307B
= 30A
= 0.035
= 55V
Units
Units
W/°C
°C/W
V/ns
mJ
mJ
°C
W
A
V
A
8/25/97

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IRLZ34N Summary of contents

Page 1

... Case-to-Sink, Flat, Greased Surface CS R Junction-to-Ambient 10V GS @ 10V GS 300 (1.6mm from case) Min. –––– –––– –––– 9.1307B IRLZ34N ® HEXFET Power MOSFET 55V DSS R = 0.035 DS(on 30A D S TO-220AB Max ...

Page 2

... IRLZ34N Electrical Characteristics @ T Parameter V Drain-to-Source Breakdown Voltage (BR)DSS Breakdown Voltage Temp. Coefficient (BR)DSS J R Static Drain-to-Source On-Resistance DS(on) V Gate Threshold Voltage GS(th) g Forward Transconductance fs I Drain-to-Source Leakage Current DSS Gate-to-Source Forward Leakage I GSS Gate-to-Source Reverse Leakage ...

Page 3

... te-to-S o urce V oltage ( Fig 3. Typical Transfer Characteristics 2 0µ LSE ° 100 = IRLZ34N 1000 VGS TOP 15V 12V 10V 8.0V 6.0V 4.0V 3.0V 100 BOTT µ LSE 75° ...

Page 4

... IRLZ34N 1400 1200 iss 1000 800 600 400 C rss 200 Drain-to-Source V oltage ( Fig 5. Typical Capacitance Vs. Drain-to-Source Voltage 5° 5° ...

Page 5

... RESPONSE) 0.01 0.00001 Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case 125 150 175 ° SINGLE PULSE 0.0001 0.001 t , Rectangular Pulse Duration (sec) 1 IRLZ34N D.U. 5.0V Pulse Width µs Duty Factor Fig 10a. Switching Time Test Circuit V DS 90% 10 ...

Page 6

... IRLZ34N 5 Fig 12a. Unclamped Inductive Test Circuit Fig 12b. Unclamped Inductive Waveforms Charge Fig 13a. Basic Gate Charge Waveform L D.U. 0.01 V (BR)DSS V DD 250 TOP BO TTOM 200 150 100 ...

Page 7

... Driver same type as D.U.T. I controlled by Duty Factor "D" SD D.U.T. - Device Under Test Period D = P.W. Waveform SD Body Diode Forward Current di/dt Waveform DS Diode Recovery dv/dt Body Diode Forward Drop Ripple for Logic Level Devices Fig 14. For N-Channel HEXFETS IRLZ34N + + P.W. Period * V =10V ...

Page 8

... IRLZ34N Package Outline TO-220AB Outline Dimensions are shown in millimeters (inches (. (. ...

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