MCP1256 Microchip Technology, MCP1256 Datasheet - Page 16

• Manufacturer Part Number: MCP1256
• Description: Regulated 3.3V, Low-Ripple Charge Pump with Low-Operating Current SLEEP Mode or BYPASS Mode
• Manufacturer: Microchip Technology

MCP1256/7/8/9
10-Lead Plastic Dual-Flat No-Lead Package (MF) 3x3x0.9 mm Body (DFN) – Saw Singulated
DS21989A-page 16
Number of Pins
Pitch
Overall Height
Standoff
Lead Thickness
Overall Length
Exposed Pad Length
Overall Width
Exposed Pad Width
Lead Width
Contact Length §
Contact-to-Exposed Pad §
* Controlling Parameter
§ Significant Characteristic
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Exposed pad varies according to die attach paddle size.
3. Package may have one or more exposed tie bars at ends.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
JEDEC equivalent: Not Registered
Drawing No. C04-063
A3
ID INDEX
(NOTE 1)
See ASME Y14.5M
See ASME Y14.5M
AREA
PIN 1
Dimension Limits
TOP VIEW
(Note 3)
(Note 3)
E
Units
D2
E2
A3
A1
n
E
D
b
L
K
e
A
A1
MIN
.000
.112
.082
.112
.008
.012
.008
D
.031
.051
.008 REF.
.020 BSC
INCHES
A
NOM
EXPOSED
(NOTE 2)
.035
.001
.118
.094
.118
.065
.010
.016
(NOTE 3)
METAL
EXPOSED
10
—
K
TIE BAR
PAD
MAX
b
.039
.002
.124
.096
.124
.067
.015
.020
—
BOTTOM VIEW
MIN
0.80
0.00
2.85
2.08
2.85
1.30
0.18
0.30
0.20
MILLIMETERS*
E2
Revised 09-12-05
© 2006 Microchip Technology Inc.
0.20 REF.
0.50 BSC
NOM
2
p
0.90
0.02
3.00
2.39
3.00
1.65
0.25
0.40
10
—
1
n
MAX
1.00
0.05
3.15
2.45
3.15
1.70
0.30
0.50
D2
—
L